Lighting device

ABSTRACT

Provided is a lighting device, comprising: a light source module comprising: at least one light source disposed on a printed circuit board; and a resin layer disposed on the printed circuit board so that the light source is embedded; a light reflection member formed on at least any one of one side surface and another side surface of the resin layer; and a diffusion plate having an upper surface formed on the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered onto the light reflection member, wherein a first separated space is formed between the light source module and the upper surface of the diffusion plate, whereby flexibility of the product itself can be secured, and durability and reliability of the product can be also improved.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/819,656, filed Mar. 16, 2020; which is a continuation of U.S.application Ser. No. 15/900,358, filed Feb. 20, 2018, now U.S. Pat. No.10,627,064, issued Apr. 21, 2020; which is a continuation of U.S.application Ser. No. 15/495,433, filed Apr. 24, 2017, now U.S. Pat. No.9,933,126, issued Apr. 3, 2018; which is a continuation of U.S.application Ser. No. 14/742,207, filed Jun. 17, 2015, now U.S. Pat. No.9,664,844, issued May 30, 2017; which is a continuation of U.S.application Ser. No. 13/920,844, filed Jun. 18, 2013, now U.S. Pat. No.9,086,209, issued Jul. 21, 2015; which claims the benefit under 35U.S.C. § 119 of Korean Patent Application Nos. 10-2012-0065259, filedJun. 18, 2012; 10-2012-0065260, filed Jun. 18, 2012; and10-2012-0065264, filed Jun. 18, 2012; which are hereby incorporated byreference in their entirety.

BACKGROUND Field of the Invention

Embodiments of the present invention relate to the technology field of alighting device.

Description of the Related Arts

An LED (Light Emitted Diode) device is a device which converts anelectrical signal to infrared rays or light using a compositionsemiconductor property. Unlike a florescent lamp, since the LED devicedoes not use harmful substances such as mercury and the like, it has alow possibility to cause environmental pollution and a long life spancompared to a conventional light source. Also, it is advantageous thatthe LED device spends low electricity compared to the conventional lightsource and has excellent visibility and low brilliantness due to a highcolor temperature.

Accordingly, a current lighting device has been developed from astructure, in which a traditional light source such as a conventionalincandescent lamp or a florescent lamp is used, to a structure, in whichthe aforesaid LED device is used as a light source. In particular, byusing a light guide plate as disclosed in Korean Laid-Open PatentPublication No. 10-2012-0009209, the lighting device which performs asurface light-emitting function has been provided.

The aforesaid lighting device is composed in a structure in which a flatlight guide plate is disposed on a substrate, and a plurality of sideview type LEDs is disposed on a side of the light guide plate in anarray shape. Here, the light guide plate is a kind of plastic moldinglens which functions to uniformly supply light emitted from the LEDs.Accordingly, in the conventional lighting device, the light guide plateis used as an essential component. However, due to a thickness of thelight guide plate itself, there is a limitation to make the thickness ofan entire product thin. Furthermore, as a material of the light guideplate is not flexible, it is disadvantageous that it would be difficultto apply the light guide plate to a part in which a bend is formed, andthus a product plan and design cannot be easily changed.

Also, as the light is partially emitted to the side of the light guideplate, light loss is generated. Thus, it is problematic that lightefficiency is reduced. Furthermore, as a temperature of the LEDsincreases at the time of light emission, it is also problematic that theLEDs' characteristics (e.g. luminous intensity and wavelengthtransition) are changed.

PRIOR ART REFERENCE Patent Reference

-   Korean Laid-Open Patent Publication No. 10-2012-0009209

BRIEF SUMMARY

Embodiments of the present invention have been made keeping in mind theabove problems occurring in the related art. An aspect of the presentinvention provides a lighting device that can get thinner in thickness,improve a degree of freedom in product design and heat dissipationefficiency, and control a wavelength shift and a reduction in luminousintensity.

Another aspect of embodiments of the present invention provides alighting device which can improve brightness by minimizing light loss.

Still another aspect of embodiments of the present invention provides alighting device which can maximize the improvement of brightness withoutthe addition of a light source by forming a reflection unit having aspacing part on a printed circuit board to improve light reflectance.

Still further another aspect of embodiments of the present inventionprovides a lighting device which can inhibit the generation of a hotspot while improving the uniformity of light by forming an opticalpattern layer having an optical pattern in the lighting device.

According to an aspect of embodiments of the present invention, there isprovided a lighting device, including: a light source module includingat least one light source disposed on a printed circuit board, and aresin layer disposed on the printed circuit board so that the lightsource is embedded; a light reflection member formed on at least one ofone side surface and another side surface of the resin layer; and adiffusion plate having an upper surface formed on the light sourcemodule, and a side wall which is integrally formed with the uppersurface and formed to extend in a lower side direction and which isadhered to the light reflection member, wherein a first separated spaceis formed between the light source module and the upper surface of thediffusion plate.

The advantageous effect according to the embodiments of the presentinvention is that the light reflection module is provided so that thelight loss generated from the side surface of the resin layer can beminimized, thereby enabling brightness and roughness of the lightingdevice to be improved.

Also, still another advantageous effect according to the embodiments ofthe present invention is that the light guide plate is removed and theresin layer is used to guide light so that the number of light emittingdevice packages can be reduced, and a total thickness of the lightingdevice can get thinner.

Also, still further advantageous effect according to the embodiments ofthe present invention is that the resin layer is formed of high heatresistant resin so that, in spite of the heat generated from the lightsource package, stable brightness can be implemented and the lightingdevice having high reliability can be provided.

Moreover, still further advantageous effect according to the embodimentsof the present invention is that the lighting device is formed using theflexible printed circuit board and the resin layer so that flexibilitycan be secured, thereby enabling a degree of freedom in product designto be improved.

Furthermore, still further advantageous effect according to theembodiments of the present invention is that the diffusion plate itselfsurrounds a side surface of the light source module so that thediffusion plate itself can perform the function of a housing, and thusas a separate structure is not used, manufacturing process efficiencyand, durability and reliability of the product itself can be improved.Also, according to the embodiments of the present invention, heatdissipation efficiency can be improved and a wavelength shift and areduction in illumination intensity can be controlled.

Also, still further advantageous effect according to the embodiments ofthe present invention is that the light reflection member is provided sothat the light loss generated from the side surface of the resin layercan be minimized, thereby enabling brightness and roughness of thelighting device to be improved.

Also, still further advantageous effect according to the embodiments ofthe present invention is that the reflection unit having the spacingpart is provided on the surface of the printed circuit board so that theimprovement of light reflectance as well as the improvement ofbrightness can be maximized. Furthermore, although the thickness of thelighting device and the number of the light source are not increased,the brightness can be improved, and thanks to a pattern design of theseparation member (i.e. a spacer) which forms the spacing part, thecontrol of light and reflection efficiency can be maximized.

Also, still further advantageous effect according to the embodiments ofthe present invention is that the optical pattern layer is formed in thelight source module so that the concentration of light and thegeneration of a hot spot can be inhibited, and the uniformity of lightsupplied to the diffusion plate can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the present invention, and are incorporated in andconstitute a part of this specification. The drawings illustrateexemplary embodiments of the present invention and, together with thedescription, serve to explain principles of the present invention. Inthe drawings:

FIG. 1 shows a lighting device according to an exemplary embodiment ofthe present invention;

FIG. 2 and FIG. 3 show first and second exemplary embodiments of a lightsource module illustrated in FIG. 1;

FIG. 4 and FIG. 5 illustrate exemplary embodiments of a separationmember which composes a reflection unit stated in FIG. 3;

FIG. 6 through FIG. 9 show third to sixth exemplary embodiments of thelight source module illustrated in FIG. 1;

FIG. 10 illustrates an exemplary embodiment of an optical pattern layeraccording to the present invention;

FIG. 11 through FIG. 15 show seventh to eleventh exemplary embodimentsof the light source module illustrated in FIG. 1;

FIG. 16 shows an exemplary embodiment of a reflection patternillustrated in FIG. 3;

FIG. 17 shows a plane view of a twelfth exemplary embodiment of thelight source module illustrated in FIG. 1;

FIG. 18 shows a cross-sectional view taken along AA′ of the light sourcemodule illustrated in FIG. 17;

FIG. 19 shows a cross-sectional view taken along BB′ of the light sourcemodule illustrated in FIG. 17;

FIG. 20 shows a cross-sectional view taken along CC′ of the light sourcemodule illustrated in FIG. 17;

FIG. 21 shows a head lamp for a vehicle according to an exemplaryembodiment of the present invention;

FIG. 22 shows a perspective view of a light emitting device packageaccording to one exemplary embodiment of the present invention;

FIG. 23 shows an upper view of the light emitting device packageaccording to the one exemplary embodiment of the present invention;

FIG. 24 shows a front view of the light emitting device packageaccording to the one exemplary embodiment of the present invention;

FIG. 25 shows a side view of the light emitting device package accordingto the one exemplary embodiment of the present invention;

FIG. 26 shows a perspective view of a first lead frame and a second leadframe illustrated in FIG. 22;

FIG. 27 is a view for explaining a dimension of each part of the firstlead frame and the second lead frame illustrated in FIG. 26;

FIG. 28 shows an enlarged view of connection parts illustrated in FIG.27;

FIG. 29 through FIG. 34 show modified exemplary embodiments of the firstlead frame and the second lead frame;

FIG. 35 shows a perspective view of a light emitting device packageaccording to another exemplary embodiment of the present invention;

FIG. 36 shows an upper view of the light emitting device packageillustrated in FIG. 35;

FIG. 37 shows a front view of the light emitting device packageillustrated in FIG. 35;

FIG. 38 shows a cross-sectional view taken along cd of the lightemitting device package illustrated in FIG. 35;

FIG. 39 shows the first lead frame and the second lead frame illustratedin FIG. 35;

FIG. 40 shows measured temperatures of the light emitting device packageaccording to some exemplary embodiment of the present invention;

FIG. 41 shows one exemplary embodiment of a light emitting chipillustrated in FIG. 22;

FIG. 42 shows a lighting device according to another exemplaryembodiment of the present invention;

FIG. 43 shows a general head lamp for a vehicle, which is a point lightsource;

FIG. 44 shows a tail light for a vehicle according to some exemplaryembodiment of the present invention;

FIG. 45 shows a general tail light for a vehicle; and

FIG. 46 and FIG. 47 show a distance between the light emitting devicepackages of the light source module used in the tail light for a vehicleaccording to some exemplary embodiments of the present invention.

DETAILED DESCRIPTION

Embodiments according to the present invention will now be describedmore fully hereinafter with reference to the accompanying drawings sothat those having ordinary skill in the art can easily embody. Thisinvention may, however, be embodied in different forms and should not beconstrued as limited to the exemplary embodiments set forth herein. Itis to be understood that the form of the present invention shown anddescribed herein is to be taken as a preferred embodiment of the presentinvention and that various changes and modifications may be made in theinvention without departing from the spirit and scope thereof. Also, inthe following description, it is to be noted that, when the functions ofconventional elements and the detailed description of elements relatedwith the present invention may make the gist of the present inventionunclear, a detailed description of those elements will be omitted.Reference will now be made in greater detail to a preferred embodimentof the invention, an example of which is illustrated in the accompanyingdrawings. Wherever possible, the same reference numerals will be usedthroughout the drawings and the description to refer to the same or likeparts.

Embodiments of the present invention relate to a lighting device. Thegist thereof is to provide a structure of the lighting device which isconfigured such that a light guide plate is removed, a resin layer isreplaced with the light guide plate, and a light reflection member isformed on a side surface of the resin layer so that brightness androughness can be improved, and a total thickness of the lighting devicecan be innovatively reduced. Furthermore, as the diffusion plate is usedas a support of the light reflection member by processing the diffusionplate, an integral property, durability and reliability of the productcan be secured, and flexibility of the lighting device itself can bealso secured.

Moreover, the lighting device according to the embodiments of thepresent invention may be applied to various lamp devices such as a lampfor a vehicle, a lighting device for home use and an industrial lightingdevice for which illumination is required. For example, when thelighting device is applied to the lamp for the vehicle, it can be alsoapplied to a headlight, indoor illumination for the vehicle, a doorscarf, a back light and the like. In addition to this, the lightingdevice of the present invention can be applied to the field of abacklight unit applied to a liquid crystal display device. Except forthis, the light device can be applied to all fields relating toillumination, which has been currently developed and commercialized orcan be realized depending on future technical development.

Hereinafter, the light source module means that remaining elementsexcept for a diffusion plate and a light reflection member are referredto as one.

FIG. 1 illustrates a lighting device 1 according to an embodiment of thepresent invention. Referring to FIG. 1, the lighting device 1 includes alight source module 100 which is a surface light source. Also, thelighting device 1 may further include a housing 150 for receiving thelight source module 100.

The light source module 100 includes at least one light source forgenerating light. The light source may be composed of a light emittingdevice package including a light emitting chip. The light source module100 may implement a surface light source by diffusing and dispersing thelight generated from the light source, which is a point light source,and may have been bent due to its flexibility.

The housing 150 may protect the light source module 100 from an impactand may be composed of a material (for example, acryl) to which thelight irradiated from the light source module 100 can be transmitted.Also, since the housing 150 may include a bending part in view of adesign and the light source module 100 may have flexibility, the lightsource module can be easily received in the bending housing 150. Ofcourse, since the housing 150 itself has constant flexibility, a totalassembly structure of the lighting device 1 itself can also haveconstant flexibility.

FIG. 2 shows a first exemplary embodiment (100-1) of the light sourcemodule illustrated in FIG. 1, and more specifically, a cross-sectionalview taken along AB of the light device illustrated in FIG. 1. Referringto FIG. 2, the light source module (100-1) includes: a printed circuitboard 10; a light source 20; and a resin layer 40 for performing thefunction of a light guide plate. A light reflection member 90 is formedon at least one of one side surface and another side surface of theresin layer 40, and a diffusion plate 70 is formed on the aforesaidlight source module 100-1.

The printed circuit board 10 may be a flexible printed circuit boardusing an insulating substrate having flexibility. For example, theflexible printed circuit board 10 may include a base member (forexample, reference numeral 5) and a circuit pattern (for example,reference numerals 6 and 7) disposed on at least one surface of the basemember (for example, reference numeral 5). A material of the base member(for example, reference numeral 5) may be a film having flexibility andan insulating property, for example, polyimide or epoxy (for example,FR-4).

More specifically, the flexible printed circuit board 10 may include aninsulating film 5 (for example, polyimide or FR-4), a first copper foilpattern 6, a second copper foil pattern 7, and a via contact 8. Thefirst copper foil pattern 6 is formed on one surface (for example, anupper surface) of the insulating film 5, and the second copper foilpattern 7 is formed on another surface (for example, a lower surface) ofthe insulating film 5. The first copper foil pattern 6 and the secondcopper foil pattern 7 may be connected through the via contact 8 formedto pass through the insulating film 5.

Hereinafter, a case in which the printed circuit board 10 is composed ofthe aforesaid flexible printed circuit board will be stated as anexample. However, this is only an example. In addition to this, varioustypes of boards may be used as the printed circuit board 10 of thepresent invention.

The light source 20 is disposed in one or more number on the flexibleprinted circuit board 10, thereby emitting light. For example, the lightsource 20 may be a side view type light emitting device package which isdisposed so that the emitted light moves to a direction 3 being toward aside surface of the resin layer 40. At this time, the light emittingchip mounted to the light emitting device package may be a vertical typelight emitting chip. For example, the light emitting chip may be a redlight-emitting chip illustrated in FIG. 43. However, the presentembodiment is not limited to this.

The resin layer 40 may be disposed in the printed circuit board 10 andan upper part of the light source 20 so that the light source 20 isembedded, and may diffuse and induce the light emitted from the lightsource 20 to a side direction of the resin layer 40 in a direction beingtoward one surface (for example, an upper surface) of the resin layer40.

The resin layer 40 may be composed of a resin material which can diffusethe light. A refractive index thereof may range from 1.4 to 1.8.However, the refractive index is not limited to this.

For example, the resin layer 40 may be composed of an ultraviolet curingresin having a high heat resistant property and including a oligomer. Atthis time, a content of the oligomer may range from 40 to 50 wt. %.Also, urethane acrylate may be used as the ultraviolet curing resin.However, it is not limited to this. In addition to this, at least onematerial of epoxy acrylate, polyester acrylate, polyether acrylate,polybutadiene acrylate, and silicon acrylate may be used.

In particular, when the urethane acrylate is used as the oligomer,different physical properties from each other may be simultaneouslyimplemented by using a mixture of two types of urethane acrylate.

For example, when isocyanate is used during synthesizing the urethaneacrylate, physical properties (i.e. a yellowing property, a weatherresistant property, and a chemically resistant property) of the urethaneacrylate are determined by the isocyanate. At this time, when any onekind of urethane acrylate is implemented as urethane acrylatetype-isocyanate, it is implemented that NCO % of PDI (isophoronediisocyanate) or IPDI (isophorone diisocyanate) becomes 37% (hereinafterreferred to as ‘a first oligomer’). Furthermore, when another one kindof urethane acrylate is implemented as the urethane acrylatetype-isocyanate, it is implemented that NCO % of PDI (isophoronediisocyanate) or IPDI (isophorone diisocyanate) becomes 30 to 50% or 25to 35% (hereinafter referred to as ‘a second oligomer’). Thus, theoligomer according to the present exemplary embodiment may be formed.According to this, as NCO % is adjusted, the first oligomer and thesecond oligomer having different physical properties from each other maybe obtained, and the oligomer which forms the resin layer 40 may beimplemented by the first and second oligomers. A weight ratio of thefirst oligomer in the oligomer may be implemented in the range of 15 to20, and a weight ratio of the second oligomer in the oligomer may beimplemented in the range of 25 to 35.

Meanwhile, the resin layer 40 may further include any one of a monomerand a photo initiator. At this time, a content of the monomer may beformed in 65 to 90 parts by weight. More specifically, the monomer maybe formed of a mixture including 35 to 45 parts by weight of IBOA(isobornyl acrylate), 10 to 15 parts by weight of 2-HEMA (2-hydroxyethylmethacrylate), and 15 to 20 parts by weight of 2-HBA (2-hydroxybutylacrylate). Moreover, the photoinitiator (for example,1-hydroxycyclohexyl phenyl-ketone, diphenyl) anddiphenyl(2,4,6-trimethylbenzoyl phosphine oxide and the like) may beformed in 0.5 to 1 parts by weight.

Also, the resin layer may be composed of a heat curing resin having ahigh heat resistant property. Specifically, the resin layer 40 may becomposed of a heat curing resin including at least one of a polyesterpolyol resin, an acryl polyol resin, a hydrocarbon-based solvent or/andan ester-based solvent. The heat curing resin may further include a hestcuring agent to improve coating strength.

In the case of the polyester polyol resin, a content of the polyesterpolyol resin may range from 9 to 30% based on a total weight of the heatcuring resin. Also, in the case of the acryl polyol resin, a content ofthe acryl polyol resin may range from 20 to 40% based on the totalweight of the heat curing resin.

In the case of the hydrocarbon-based solvent or the ester-based solvent,a content thereof may range from 30 to 70% based on the total weight ofthe heat curing resin. In the case of the heat curing agent, a contentthereof may range from 1 to 10% based on the total weight of the heatcuring resin. When the resin layer 40 is formed of the aforesaidmaterials, the heat resistant property of the resin layer is reinforced.Thus, even though the resin layer is used in the lighting device fromwhich the heat of a high temperature is emitted, a reduction inbrightness due to heat can be minimized, thereby enabling the lightingdevice having high reliability to be provided.

Also, according to the present embodiment of present invention, as theaforesaid materials are used to implement a surface light source, athickness of the resin layer 40 can be innovatively reduced. Thus, awhole product can be implemented to get thinner in thickness.Furthermore, according to the present invention, since the lightingdevice is formed using the flexible printed circuit board and the resinlayer made of a flexible material, it can be easily applied to a bendingsurface. Thus, it is advantageous that a degree of freedom in design canbe improved, and the lighting device can be applied to other flexibledisplay devices.

The resin layer 40 may include a diffusion material 41 having a hollow(or a pore space) in an inner part thereof. The diffusion material 41may have a shape which is mixed or diffused with resin which composesthe resin layer 40, and may function to improve light reflection anddiffusion properties.

For example, as light emitted from the light source 20 to an inner partof the resin layer 40 is reflected and transmitted by the hollow of thediffusion material 41, the light may be diffused and concentrated in theresin layer 40, and the diffused and concentrated light may be emittedto one surface (e.g. an upper part surface) of the resin layer 40. Atthis time, since reflectance and a diffusion rate of the light areimproved due to the diffusion material 41, an amount and uniformity ofthe emission light supplied to the upper surface of the resin layer 40can be improved, thereby enabling brightness of the light source module100-1 to be improved.

A content of the diffusion material 41 may be appropriately adjusted toobtain a desired light diffusion effect. Specifically, the content maybe adjusted in the range of 0.01 to 0.3% based on the total weight ofthe resin layer 40. However, the content is not limited to this. Thediffusion material 41 may be composed of any one selected from the groupconsisting of silicon, silica, glass bubble, PMMA, urethane, Zn, Zr,Al₂O₃, and acryl. A particle diameter of the diffusion material 41 maybe 1 μm to 20 μm. However, the particle diameter is not limited to this.

The light reflection member 90 is formed on at least one of one sidesurface and another side surface of the resin layer 40. The lightreflection member 90 guides so that the light irradiated from the lightemitting device 20 is emitted to the upper part of the resin layer, andperforms as a guide function for inhibiting light from being emittedthrough the side surface of the resin layer 40 to the outside. Thereflection member 90 may be composed of a material having excellentlight reflectance such as a white resist. In addition to this, the lightreflection member 90 may be composed of a synthetic resin in which awhite pigment is dispersed, or a synthetic resin in which metalparticles having an excellent light reflection property are dispersed.At this time, titanium oxide, aluminum oxide, zinc oxide, leadcarbonate, barium sulfate, calcium carbonate and the like may be used asthe white pigment. When the metal particles are included, Ag powdershaving excellent reflectance may be included. Also, a separatefluorescent brightening agent may be additionally included. That is, thelight reflection member 90 of the present embodiment of the inventionmay be formed using all materials having excellent light reflectance,which has developed or can be implemented depending on future technicaldevelopment. Meanwhile, the light reflection member 90 may be directlymolded and connected to the side surface of the resin layer 40 or may bebonded thereto by a separate adhesive material (or an adhesive tape).

Moreover, the light reflection member 90 may be directly molded andconnected to an inner side of a side wall 73 of the diffusion plate 70,may be bonded thereto by a separate adhesive material or may beconnected to the diffusion plate 70 by being directly printed to theinner side of the side wall 73.

Also, the drawing illustrates that the light reflection member 90 isformed all over the inner side of the side wall 73 of the diffusionplate 70. However, this is only one example. The light reflection member90 may be formed only on the side surface of the resin layer 40 or maybe formed on both the side surface of the resin layer 40 and the sidesurface of the printed circuit board 10. That is, if the range includesthe side surface of the resin layer 40, the formation range of the lightreflection member 90 is not limited.

Thus, as the light reflection member 90 is formed on the side surface ofthe resin layer 40, the leakage of light to the side surface of theresin layer 40 can be inhibited, so light loss can be reduced, lightefficiency can be improved, and brightness and roughness of the lightingdevice can be improved under a same electricity condition.

The diffusion plate 70 may be disposed in an upper part of the lightsource module 100-1, more specifically, on the resin layer 40, and mayfunction to uniformly diffuse the light emitted through the resin layer40 throughout a whole surface. A thickness of the diffusion plate 70 maybe basically formed in the range of 0.5 to 5 mm. However, the thicknessis not limited to this. The thickness may be appropriately designed andchanged depending on the lighting device's spec. In particular, asillustrated in FIG. 2, the diffusion plate 70 of the present inventionis formed in a structure having an upper surface 71 and the side wall 73integrally formed with the upper surface 71. At this time, the side wall73 surrounds a side surface of the light source module 100-1. Thediffusion plate 70 may be generally formed of an acryl resin. However,the material is not limited to this. In addition to this, the diffusionplate 70 may be formed of a high penetrating plastic material capable ofperforming a light diffusion function such as poly styrene (PS),polymethyl methacrylate (PMMA), cyclic olefin copolymer (COC),polyethylene terephthalate (PET), and resin.

A first separated space 80 may be present between an upper surface ofthe diffusion plate 70 and the resin layer. Thanks to the existence ofthe first separated space, a difference in refractive index with theresin layer 40 may be generated, thereby enabling the uniformity oflight supplied to the diffusion plate 70 to be improved. Consequently,the uniformity of light diffused and emitted through the diffusion plate70 may be improved. At this time, to minimize a deviation in light whichtransmits the resin layer 40, a thickness of the first separated space80 may be formed in the range which is more than 0 but is less than 30mm. However, the thickness is not limited to this. This can be changedin design as needed.

The side wall 73 of the diffusion plate 70 surrounds the side surface ofthe light source module 100-1. As described above, the side wall 73 mayperform the function of a support for supporting the light reflectionmember 90 and the function of a housing for protecting the light sourcemodule 100-1. That is, the diffusion plate 70 according to the presentembodiment of the invention may perform the function of the housing 150illustrated in FIG. 1 as needed. Accordingly, the diffusion plate itselfsurrounds the side surface of the light source module 100-1, so thediffusion plate itself may perform the function of the housing. Thus, asa separate structure is not used, it is advantageous that manufacturingprocess efficiency and durability and reliability of the product itselfcan be improved.

Referring to FIG. 3, a light source module 100-2 may have a structure inwhich the reflection unit 30 and a reflection pattern 31 are added tothe first exemplary embodiment.

The reflection unit 30 may be disposed between the flexible printedcircuit board 10 and the resin layer 40, and the reflection pattern 31may be further formed on the reflection unit 30. The reflection unit 30and the reflection pattern 31 may function to improve the reflectance oflight emitted from the light source 20.

The reflection unit 30 may be composed of a material having highreflection efficiency. The reflection unit 30 reflects the lightirradiated from the light source 20 onto one surface (for example, anupper surface) of the resin layer 40 so that the light is not leaked toanother surface (for example, a lower surface) of the resin layer 40,thereby enabling light loss to be reduced. The reflection unit 30 may becomposed in a single film form. To realize a characteristic forpromoting the reflection and diffusion of light, the reflection unit 30may be formed of the synthetic resin in which the white pigment isdispersedly contained.

For example, titanium oxide, aluminum oxide, zinc oxide, lead carbonate,barium sulfate, calcium carbonate and the like may be used as the whitepigment. Polyethylene terephthalate, polyethylene naphthalate, acrylresin, poly carbonate, polystyrene, polyolefin, cellulose acetate,weather resistant vinyl chloride and the like may be used as thesynthetic resin. However, the present invention is not limited to this.

Also, the reflection unit 30 may have a spacing part in an inner partthereof. The more detailed contents will be described in the descriptionof FIG. 4 and FIG. 5.

The reflection pattern 31 may be disposed on a surface of the reflectionunit 30 and may function to scatter and disperse incident light. Thereflection pattern may be formed by printing the surface of thereflection unit with a reflection ink including any one of TiO₂, CaCO₃,BaSO₄, Al₂O₃, Silicon, and PS (Polystyrene). However, it is not limitedto this.

Also, a structure of the reflection pattern 31 may be a plurality ofprotruding patterns and may be regular or irregular. To improve thescattering effect of light, the reflection pattern 31 may be formed in aprism shape, a lenticular shape, a lens shape or a combined shapethereof. However, the shape is not limited to this. Also, in FIG. 3, across section shape of the reflection pattern 31 may be composed invarious shapes such as a polygonal shape of a triangular shape, aquadrangular shape and the like, a semicircular shape, a sinusoidalshape and the like. Also, when looking down the reflection pattern 31from the above, the shape thereof may be composed in a polygonal shape(e.g. a hexagonal shape), a circular shape, an elliptical shape or asemicircular shape.

FIG. 16 shows one embodiment of the reflection pattern illustrated inFIG. 3. Referring to FIG. 16, the reflection pattern 31 may havedifferent diameters from each other depending on a separation distancewith the light source 20.

For example, as the reflection pattern 31 becomes gradually adjacent tothe light source 20, a diameter of the reflection pattern 31 may belarger. Specifically, the diameter may be large in the order of a firstreflection pattern 31-1, a second reflection pattern 31-2, a thirdreflection pattern 31-3 and a fourth reflection pattern 31-4. However,the present embodiment is not limited to this. In addition to this, thereflection pattern 31 of the present embodiment of the invention may beformed in various configurations such a configuration in which a densityis changed depending on a distance with the light source, and aconfiguration in which a size and a density are all changed depending ona distance with the light source.

In the lighting device of the embodiment of the present invention statedin the description of the FIG. 3, FIG. 4 illustrates some embodiments ofthe reflection unit 30 and a separation member 37 which composes thereflection unit 30.

Referring to FIG. 3 to (a) of FIG. 4, the reflection unit 30 formed onthe flexible printed circuit board has a first spacing part 36 in aninner pail thereof. The first spacing part 36 functions to maximizebrightness by increasing reflection efficiency of the light emitted fromthe light source.

In particular, the reflection unit 30 may include a first reflectionsheet 33 which is closely bonded onto the surface of the flexibleprinted circuit board (reference numeral 10 of FIG. 3), and a secondreflection sheet 35 made of a transparent material and spaced apart fromthe first reflection film 33 to form the first spacing part 36. Thefirst and second reflection sheets 33, 35 are laminated on the flexibleprinted circuit board (reference numeral 10 of FIG. 3) and pass througha hole formed on the reflection unit 30 so that the light source(reference numeral 20 of FIG. 2) protrudes to the outside.

The first spacing part 36 may be formed by integrally compressing thefirst and second reflection sheets 33, 35 without using a separatemember such as an adhesive agent. Furthermore, as illustrated in thedrawing, the first spacing part 36, in which air is received through theseparation member 37 such as an adhesive member, may be implementedbetween the first reflection film 33 and the second reflection film 35.

The first reflection sheet 33 may be formed using a reflection materialwhich reflects light, for example, a film in which a metal layer such asAg is formed on a base member. Alternately, the first reflection sheet33 may be implemented using the synthetic resin, in which a whitepigment is dispersedly contained, such as white PET (polyethyleneterephthalate) in order to implement a characteristic for promoting thereflection and dispersion of the light. At this time, titanium oxide,aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calciumcarbonate and the like may be used as the white pigment. Polyethyleneterephthalate, polyethylene naphthalate, acryl resin, poly carbonate,polystyrene, polyolefin, cellulose acetate, weather resistant vinylchloride and the like may be used as the synthetic resin. However, thepresent embodiment is not limited to this.

The second reflection sheet 35 may be implemented by a film made of atransparent material such as PET so that light emitted from the lightsource (reference numeral 20 of FIG. 3) is transmitted to the surface ofthe first reflection film 33 and the transmitted light is againreflected.

Meanwhile, the reflection pattern 31 may be further formed on the secondreflection sheet 33 so that brightness can be improved by more promotingthe dispersion of light. The reflection pattern 31 is an element whichfunctions to scatter and disperse the incident light. The reflectionpattern 31 may be formed by printing a surface of the second reflectionsheet 35 with a reflective ink including any one of TiO₂, CaCO₃, BaSO₄,Al₂O₃, Silicon, and PS (Polystyrene). However, the present embodiment isnot limited to this.

(b) of FIG. 4 illustrates an exemplary embodiment of the separationmember which composes the aforesaid reflection unit 30 stated in (a) ofFIG. 4. The separation member 37 according to the present invention mayimplement the first spacing part 36 by performing only a generalseparation function such as a spacer member for simply separating thefirst reflection sheet 33 from the second reflection sheet 35 or aspacer member having an adhesive property. More preferably, in order toimprove adhesive efficiency at the same time as improving dispositionefficiency of the spacing part, when the separation member isimplemented, a patterning structure illustrated in (b) of FIG. 4 may beuniformly and randomly formed.

The separation member 37 illustrated in (b) of FIG. 4 may be implementedin a two-dimensional or three-dimensional structure in which a pluralityof unit separation members 37 a having a pore space part in an innerpart is disposed, and a first spacing part 36 is implemented in astructure in which an inner side of the unit separation member 37 a isempty. At this time, a cross-section of the unit separation member 37 amay be implemented in various shapes such as a polygonal shape, acircular shape and the like. In particular, as illustrated, in additionto a structure in which the plurality of unit separation members 37 a isdisposed to be closely adhered to each other, the plurality of unitseparation members 37 a is irregularly disposed, so except for the firstspacing part 36 of the inner part of the unit separation members 37 a, asecond separation part 37 c, which is composed of a vacant space amongthe unit separation members 37 a, may be further formed. Thus, in thelighting device of the present embodiment of the invention including theaforesaid reflection unit 30, as the reflection unit 30 having theseparation area is provided, the improvement of brightness as well asthe improvement of light reflectance may be maximized. Also, although athickness of the lighting device or the number of light sources is notincreased, the brightness can be increased, and thanks to a patterndesign of the separation member (the spacer) which forms the spacingpart, the control of light and reflection efficiency can be maximized.

FIG. 5 illustrates detailed one exemplary embodiment of the reflectionunit stated in FIG. 4.

As aforesaid, the reflection unit 30 according to the present embodimentof the invention includes the first reflection sheet 33 which is closelybonded onto the surface of the flexible printed circuit board, and thesecond reflection sheet 35 which is disposed to be opposite to the firstreflection film 33.

In particular, the film of the transparent material such as PET and thelike may be applied to the second reflection sheet 35. The separationmember 37 for separating the first reflection sheet 33 from the secondreflection sheet 35 is provided by patterning an adhesive material,thereby enabling the spacing part to be formed.

In particular, to maximize reflection efficiency, the first reflectionsheet 33 has a film 331 onto which a metal reflection layer 38 is bondedby an adhesive agent (i.e. a primer). The film 331 may be alsoimplemented in a structure which is laminated on a release film 335 bythe adhesive material 333 (i.e. PSA). However, this is only one example.In addition to this, the first reflection sheet 33 of the presentembodiment of the invention may be also implemented using white PET,which is the same as previously described in the description of FIG. 4.

FIG. 6 shows a third exemplary embodiment 100-3 of the light sourcemodule illustrated in FIG. 1. The same reference numerals as those ofFIG. 2 represent the same elements, and the contents overlapping withthose stated earlier are omitted or are briefly stated.

Referring to FIG. 6, the light source module 100-3 may have a structurein which an optical pattern layer 50 is added to the first exemplaryembodiment.

The optical pattern layer 50 is disposed on the resin layer 40 andtransmits the light emitted from one surface (for example, the uppersurface) of the resin layer 40. The optical pattern layer 50 may becomposed of a single optical sheet. In this case, the optical patternlayer 50 may be formed using a material having excellent lighttransmittance, for example, PET (Polyethylene Telephthalate).

Meanwhile, when the optical pattern layer 50 is formed of the singleoptical sheet, the first separated space 80 as stated in the descriptionof FIG. 2 may be formed between the upper surface 71 of the diffusionplate 70, and the optical sheet. Thanks to the existence of the firstseparated space 80, the uniformity of light supplied to the diffusionplate 70 can be improved. Consequently, the uniformity of light diffusedand emitted through the diffusion plate 70 can be improved, which is thesame as previously described in the description of FIG. 2.

FIG. 6 and the optical pattern layer having other structures will bestated in the description of FIG. 8 to FIG. 10.

FIG. 7 shows a fourth exemplary embodiment 100-4 of the light sourcemodule illustrated in FIG. 1. The same reference numerals as those ofFIG. 2 represent the same elements, and the contents overlapping withthose stated earlier are omitted or are briefly stated.

Referring to FIG. 7, to improve heat dissipation efficiency, the fourthexemplary embodiment may have a structure in which a heat dissipationmember 110 is further included in the first exemplary embodiment.

The heat dissipation member 110 is disposed on a lower surface of theflexible printed circuit board 10 and functions to emit the heatgenerated from the light source 20 to the outside. That is, the heatdissipation member 110 can improve efficiency for emitting the lightgenerated from the light source 20, which is a heat source, to theoutside.

For example, the heat dissipation member 110 may be disposed on oneportion of the lower surface of the flexible printed circuit board 10.The heat dissipation member 110 may include a plurality of heatdissipation layers (e.g. 110-1, 110-2) which is spaced apart from eachother. In order to improve a heat dissipation effect, at least a part ofthe heat dissipation layers 110-1, 110-2 may overlap with the lightsource 20 in a vertical direction. Here, the vertical direction may be adirection which is toward the resin layer 40 from the flexible printedcircuit board 10.

The heat dissipation member 110 may be a material having high heatconductivity such as Al, an Al alloy, Cu, or a Cu alloy. Alternately,the heat dissipation member 110 may be an MCPCB (Metal Core PrintedCircuit Board). The heat dissipation member 110 may be bonded onto thelower surface of the flexible printed circuit board 10 by an acryl-basedadhesive agent (not drawn).

In general, when the temperature of a light emitting device increasesdue to heat generated from the light emitting device, luminous intensityof the light emitting device may be reduced, and the wavelength shift ofgenerated light may be generated. In particular, when the light emittingdevice is a red light emitting diode, the wavelength shift and thereduction in luminous intensity may be severely generated.

However, the light source module 100-4 may control an increase intemperature of the light source by providing the heat dissipation member110 on the lower surface of the flexible printed circuit board 10 toefficiently emit the heat generated from the light source 20. Thus, thereduction in luminous intensity of the light source module 100-4 or thegeneration of the wavelength shift of the light source module 100-4 maybe controlled.

FIG. 7 illustrates a structure in which the heat dissipation member 110is added to the light source module 100-1 of FIG. 2. However, it wouldalso be obvious to those having ordinary skill in the art that the heatdissipation member can be also added to the light source modules 100-2,100-3 of FIG. 3 and FIG. 6 which are the second exemplary embodiment andthe third exemplary embodiment.

FIG. 8 shows a fifth exemplary embodiment 100-5 of the light sourcemodule illustrated in FIG. 1.

Referring to FIG. 8, the light source module 100-5, which is the opticalpattern layer 50 added to the fourth exemplary embodiment 100-4, may becomposed in a structure in which the optical pattern layer 50 includes afirst optical sheet 52, an adhesive layer 56, an optical pattern 60 anda second optical sheet 54.

The first optical sheet 52 is disposed on the resin layer 40, and thesecond optical sheet is disposed on the first optical sheet 52. Thefirst optical sheet 52 and the second optical sheet 54 may be formedusing a material having excellent light transmittance. For example, PETmay be used as the material. At this time, a thickness of the firstoptical sheet 52 or the second optical sheet may be formed in the rangeof 12 to 300 μm. However, the thickness is not limited to this. Thethickness may be appropriately changed depending on the lightingdevice's spec.

The adhesive layer 56 is disposed between the first optical sheet 52 andthe second optical sheet 54 to bond the first optical sheet 52 to thesecond optical sheet 54.

The optical pattern 60 may be disposed on at least one of an uppersurface of the first optical sheet 52 or a lower surface of the secondoptical sheet 54. The optical pattern 60 may be bonded onto at least oneof the upper surface of the first optical sheet 52 and the lower surfaceof the second optical sheet 54 by the adhesive layer 56. Meanwhile, oneor more optical sheets (not drawn) may be further included in the secondoptical sheet 54. The optical pattern 60 may be a light shieldingpattern for inhibiting the concentration of light emitted from the lightsource 20. The optical pattern 60 may be aligned in the light source 20and may be formed in a type which is bonded to the first optical sheetand the second optical sheet by the adhesive layer 56 or may be formedby being directly printed on at least any one surface of the firstoptical sheet 52 and the second optical sheet 54.

The first optical sheet 52 and the second optical sheet 54 may be formedusing a material having excellent light transmittance. For example, PETmay be used as the material. The optical pattern 60 basically functionsto inhibit the concentration of the light emitted from the light source20. That is, the optical pattern 60 as well as the aforesaid reflectionpattern 31 may function to implement uniform surface light emission.

The optical pattern 60 may be a light shielding pattern for partiallyshielding the light emitted from the light source 20 and may inhibit areduction in optical characteristic or a yellowish phenomenon which isgenerated due to the excessively strong strength of light. For example,the optical pattern 60 may inhibit the concentration of light to an areawhich is adjacent to the light source 20 and may function to dispersethe light.

The optical pattern 60 may be formed by performing a printing processfor the upper surface of the first optical sheet 52 or the lower surfaceof the second optical sheet 54 using the light shielding ink. Theoptical pattern 60 may adjust a light shielding degree or a lightdiffusion degree by adjusting at least one of a density and a size ofthe optical pattern so that the optical pattern 60 does not function tocompletely shield the light, but functions to partially shield anddiffuse the light. As one example, to improve light efficiency, as adistance between the optical pattern 60 and the light source 20increases, a density of the optical pattern may be adjusted to getlower. However, the present embodiment is not limited to this.

Specifically, the optical pattern 60 may be implemented in anoverlapping print structure of a composite pattern. The overlappingprint structure means a structure in which one pattern is formed, andanother pattern is printed on an upper part thereof.

As one example, the optical pattern 60 may include a diffusion patternand a light shielding pattern, and may be have a structure in which thediffusion pattern and the light shielding pattern overlap with eachother. For example, the diffusion pattern may be formed on a lowersurface of a polymer film (e.g. the second optical sheet 54) in a lightemitting direction using a light shielding ink including one or morematerials selected from the group consisting of TiO₂, CaCO₃, BaSO₄,Al₂O₃, Silicon, and PS (polystyrene). Furthermore, the light shieldingpattern may be formed on the surface of the polymer film using a lightshielding ink including Al or a mixture of Al and TiO₂.

That is, after the diffusion pattern is formed by white-printing it onthe surface of the polymer film, the light shielding pattern is formedthereon. In the reverse order of the above one, the diffusion patternmay be formed in a double structure. Of course, it would be obvious thata formation design of this pattern may be variously modified inconsideration of the efficiency and strength of light, and a lightshielding rate.

Alternately, in another exemplary embodiment, the optical pattern 60 mayhave a triple structure including the first diffusion pattern, thesecond diffusion pattern, and the light shielding pattern disposedtherebetween. In this triple structure, the optical pattern 60 may beimplemented using the aforesaid materials. As one example, the firstdiffusion pattern may include TiO₂ having excellent refractive index,the second diffusion pattern may include CaCO₃ and TiO₂ having excellentlight stability and color sense, and the light shielding pattern mayinclude Al having an excellent concealing property. Thanks to theoptical pattern having the triple structure, the present exemplaryembodiment can secure the efficiency and uniformity of light. Inparticular. CaCO₃ may function to reduce a yellowish phenomenon. Throughthis function, CaCO₃ may function to finally implement white light,thereby enabling light having more stable efficiency to be implemented.In addition of CaCO₃, inorganic materials having a large particle sizesuch as and a similar structure to BaSO₄, Al₂O₃, silicon may be utilizedas a diffusion material used in the diffusion pattern.

The adhesive layer 56 may surround a periphery part of the opticalpattern 60 and may fix the optical pattern 60 to at least any one of thefirst optical sheet 52 and the second optical sheet 54. At this time, aheat curing PSA, a heat curing adhesive agent or a UV curing PSA typematerial may be used in the adhesive layer 56. However, the presentinvention is not limited to this.

FIG. 9 shows a sixth exemplary embodiment 100-6 of the light sourcemodule illustrated in FIG. 1.

Referring to FIG. 9, the light source module 100-6 may have a structurein which a second spacing space 81 is added to the fifth exemplaryembodiment. That is, the optical pattern layer 50 in the sixth exemplaryembodiment 100-6 may include the first optical sheet 52, the adhesivelayer 56, the second optical sheet 54, the optical pattern, and thesecond spacing space 81 formed between the first optical sheet 52 andthe second optical sheet 54.

For example, the second spacing space 81 may be formed in the adhesivelayer 56. The adhesive layer 56 may form a separated space (i.e. thesecond spacing space 81) around the optical pattern 60. Furthermore, byapplying an adhesive material to remaining parts, the adhesive layer 56may be implemented in a structure in which the first optical sheet 52and the second optical sheet 54 are bonded to each other.

The adhesive layer 56 may be composed in a structure in which the secondspacing space 81 is located in the periphery part of the optical pattern60. Alternately, the adhesive layer 56 may be composed in a structure inwhich the adhesive layer 56 surrounds the periphery part of the opticalpattern 60, and the second spacing space 81 is located in a remainingpart except for the periphery part. The adhesive structure of the firstoptical sheet 52 and the second optical sheet 54 may also implement afunction for fixing the printed optical pattern 60. Since the secondspacing space 81 and the adhesive layer 56 have different refractiveindexes from each other, the second spacing space 81 may improve thediffusion and dispersion of light, which moves to a direction of thesecond optical sheet 56 from the first optical sheet 52. Due to this, amore uniform surface light source can be implemented.

FIG. 10 conceptually illustrates the configuration of the opticalpattern layer (reference numeral 50 of FIG. 9) illustrated in FIG. 9.The adhesive layer 56 is formed in a structure which surrounds aroundthe optical pattern 60 which is printed as a specific pattern on thefirst optical sheet stated in the description of FIG. 9, and the secondoptical sheet is bonded thereto, so a regular separated space is formed.This separated space forms the second spacing space 81 having a closedstructure in which an air layer is formed. At this time, the shape of aplane of the second spacing space 81 formed by the adhesive layer 56 maybe composed in a circular shape as illustrated in the drawing. Inaddition to this, the shape may be implemented in various shapes such asan elliptical shape, a rectangular shape, a quadrate shape, a polygonalshape and the like.

FIG. 11 shows a seventh exemplary embodiment 100-7 of the light sourcemodule illustrated in FIG. 1. Referring to FIG. 11, the light sourcemodule 100-7 may have a structure in which via holes 212, 214 forimproving heat dissipation are provided in the flexible printed circuitboard 10 of the first exemplary embodiment.

The via holes 212, 214 may pass through the flexible printed circuitboard 110 and may expose a part of the light source 20 or a part of theresin layer 40. For example, the via holes 212, 214 may include a firstvia hole 212 to which the part of the light source 20 is exposed, and asecond via hole 214 to which a part of the lower surface of the resinlayer 40 is exposed.

The heat generated from the light source which is a heat source may bedirectly emitted through the first via hole 212 to the outside. The heattransmitted from the light source 20 to the resin layer 40 may bedirectly emitted through the second via hole 214 to the outside. Thesixth exemplary embodiment may improve the heat dissipation efficiencybecause the heat generated from the light source 20 is emitted throughthe via holes 212, 214 to the outside. The first via hole 212 and thesecond via hole 214 may have various shapes such as a polygonal shape, acircular shape, an elliptical shape and the like.

Also, it would be obvious to those having ordinary skill in the art thatthe via holes 212, 214 can be also included in the second and thirdexemplary embodiments, even though this is not illustrated in thedrawing.

FIG. 12 shows an eighth exemplary embodiment 100-8 of the light sourcemodule illustrated in FIG. 1. The same reference numerals as those ofFIG. 1 represent the same elements, and the contents overlapping withthose stated earlier are omitted or are briefly stated.

Referring to FIG. 12, unlike the heat dissipation member 110 of thefourth exemplary embodiment 100-4, a heat dissipation member 310 of thelight source module 100-8 may have a lower heat dissipation layer 310-1which is disposed on the lower surface of the flexible printed circuitboard 10, and a through part 310-1 in which a part of the lower heatdissipation layer 310-1 is in contact with the light source 20 bypassing through the flexible printed circuit board 10.

For example, the through part 310-1 may be in contact with a first sidesurface part 714 of first lead frames 620, 620′ of light emitting devicepackages 200-1, 200-2 which will be described later.

According to the eighth exemplary embodiment, thanks to the through part310-1, since the heat generated from the light source 20 is directlytransmitted to the heat dissipation member 310 and the transmitted lightis emitted to the outside, the heat dissipation efficiency can beimproved.

Also, it would be obvious to those having ordinary skill in the art thatthe heat dissipation member 310 can be also included in the aforesaidsecond and third exemplary embodiments even through this is notillustrated in the drawing.

FIG. 13 shows a ninth exemplary embodiment 100-9 of the light sourcemodule illustrated in FIG. 1, FIG. 14 shows a tenth exemplary embodiment100-9 of the light source module illustrated in FIG. 1, and FIG. 15shows an eleventh exemplary embodiment 100-9 of the light source moduleillustrated in FIG. 1.

The light source module illustrated in FIG. 13 to FIG. 15 may have astructure in which an additional element is further added to thereflection sheet 30, the second optical sheet 54 and the diffusion plate70.

More specifically, embossments R1, R2, R3 may be formed on at least onesurface or both surfaces of the reflection sheet 30, the second opticalsheet 54 and the diffusion plate 70. The embossments R1, R2, R3 reflectand diffuse the incident light, thereby enabling the light emitted tothe outside to form a geometrical pattern.

For example, the first embossment R1 may be formed on one surface (e.g.the upper surface) of the reflection sheet 30, the second embossment R2may be formed on one surface (e.g. the upper surface) of the secondoptical sheet 54, and the third embossment R3 may be formed on onesurface (e.g. the lower surface) of the diffusion plate 70. Theseembossments R1, R2, R3 may be formed in a structure in which a pluralityof patterns is regularly or irregularly provided. To improve a lightreflection and diffusion effect, the embossments may be composed in aprism shape, a lenticular shape, a concave lens shape, a convex lensshape or a combined shape thereof. However, their shape is not limitedto this.

Also, each cross-sectional shape of the embossments R1, R2, R3 may becomposed in various structures having various shapes such as atriangular shape, a quadrangular shape, a semi-circular shape, asinusoidal shape and the like. Furthermore, each pattern size anddensity may be changed depending on a distance with the light source 20.

The embossments R1, R2, R3 may be formed by directly processing thereflection sheet 30, the second optical sheet 54 and the diffusion plate70. This is not limited. The embossments R1. R2. R3 may be formed by amethod of attaching a film in which regular patterns are formed, amethod of directly attaching a lens (e.g. a prism lens and a lenticularlens) and all other methods which have been developed and commercializedor can be implemented depending on future technical development.

In the present exemplary embodiment, a geometrical optical pattern maybe easily implemented through a combination of the patterns of the firstto third embossments R1. R2, R3. In another exemplary embodiment, theembossments may be formed on one surface or both surfaces of the secondoptical sheet 54.

However, the exemplary embodiments in which the embossment R1. R2 or R3is formed are not limited to FIG. 13 to FIG. 15. To improve the lightreflection and diffusion effect, the embossment R1, R2 or R3 may be alsoformed on at least one surface or both surfaces of the reflection sheet30, the first optical sheet 52, the second optical sheet 54 and thediffusion plate 70 included in the other exemplary embodiments.

FIG. 17 shows a plane view of a twelfth exemplary embodiment 100-12 ofthe light source module illustrated in FIG. 1, FIG. 18 shows across-sectional view taken along AA′ of the light source module 100-12illustrated in FIG. 17, FIG. 19 shows a cross-sectional view taken alongBB′ of the light source module 100-12 illustrated in FIG. 17, and FIG.20 shows a cross-sectional view taken along CC′ of the light sourcemodule 100-12 illustrated in FIG. 17.

Referring to FIG. 17 to FIG. 20, the light source module 100-12 mayinclude a plurality of sub-light source modules 101-1 to 101-n (nrepresents natural numbers greater than 1, n>1). The plurality ofsub-light source modules 101-1 to 101-n may be separated from orconnected to each other. Also, the plurality of sub-light source modules101-1 to 101-n may be electrically connected to each other. At thistime, the formation of the diffusion plate 70 and the light reflectionmember 90 may be performed by combining each sub-light source module101-1 to 101-n with each other, and thereafter connecting the diffusionplate 70 formed in an inner side of the side wall 73 to the entirecombination structure using the light reflection member 90.

Each sub-light source module 101-1 to 101-n includes at least oneconnector (e.g. 510, 520, 530) which may be connected to the outside.For example the first sub-light source module 101-1 may include thefirst connector 510 including at least one terminal (e.g. S1, S2). Thesecond sub-light source 101-2 may include the first connector 520 andthe second connector 530 which are connected to the outside,respectively. The first connector 520 may include at least one terminal(e.g. P1, P2), and the second connector 530 may include at least oneterminal (e.g. Q1, Q2). At this time, the first terminal (S1, P1, Q1)may be a positive (+) terminal, and the second terminal (S2, P2, Q2) maybe a negative (−) terminal. FIG. 19 illustrates that each connector(e.g. 510, 520, 530) includes two terminals. However, the number ofterminals is not limited to this.

FIG. 18 through FIG. 20 illustrate a structure in which the connector510, 520 or 530 is added to the sixth exemplary embodiment 100-6.However, the structure is not limited to this. The respective sub-lightsource modules 101-1 to 101-n may have a structure in which theconnector 510, 520 or 530 and a connection fixing unit (e.g. 410-1,420-1, 420-2) are added to the light source module according to any oneof the aforesaid exemplary embodiments.

Referring to FIG. 18 and FIG. 19, the respective sub-light sourcemodules 101-1 to 101-n include: the flexible printed circuit board 10;the light source 20; the reflection sheet 30; the reflection pattern 31;the resin layer 40; the first optical sheet 52; the second optical sheet54; the adhesive layer 56; the optical pattern 60; the heat dissipationmember 110; at least one connector 510, 520 or 530; and at least oneconnection fixing unit 410, 420. The same reference numerals as those ofFIG. 1 represent the same elements, and the contents overlapping withthose stated earlier are omitted or are briefly stated. Comparing thepresent exemplary embodiment with other exemplary embodiments, therespective sub-light source modules 101-1 to 101-n of the twelfthexemplary embodiment may have a difference with respect to each size oreach number of light sources, but except for the connector and theconnection fixing unit, the structure thereof may be identical to eachstructure of other exemplary embodiments.

The first sub-light source module 101-1 may be electrically connected tothe light source 20 and may include a first connector 510 provided tothe flexible printed circuit board 10 so as to be electrically connectedto the outside. For example, the first connector 510 may be implementedin a type which is patterned on the flexible printed circuit board 10.

Also, the second sub-light source module 101-2 may include the firstconnector 520 and the second connector 530 which are electricallyconnected to the light source 20. The first connector 520 may beprovided at one side of the flexible printed circuit board 10 to beelectrically connected to the first connector 510 of the outside (e.g.the first sub-light source module 101-1). The second connector 530 maybe provided at another side of the flexible printed circuit board 10 tobe electrically connected to the connector (not drawn) of anotheroutside (e.g. the third sub-light source module 101-3).

Connection fixing units (e.g. 410-1, 420-1, 420-2) are connected toother sub-light source modules of the outside and function to fix twoconnected sub-light source modules to each other. The connection fixingunits 410-1, 420-1, 420-2 may be a protrusion part (p) having a type inwhich a part of the side surface of the resin layer 40 protrudes, or agroove part having a type in which a part of the side surface of theresin layer 40 is recessed.

Referring to FIG. 20, the first sub-light source module 101-1 mayinclude a first connection fixing unit 410-1 having a structure in whicha part of the side surface of the resin layer 40 protrudes. Also, thesecond sub-light source module 101-2 may include the first connectionfixing unit 420-1 having a structure in which a part of the side surfaceof the resin layer 40 is recessed.

The first connection fixing unit 410-1 of the first sub-light sourcemodule 101-1 and the first connection fixing unit 420-1 of the secondsub-light source module 101-2 may be connected and fixed to each other.

The present exemplary embodiment illustrates that the connection fixingunit (e.g. 410-1, 420-1) is implemented in a part of the resin layer 40.However, the exemplary embodiment is not limited to this. A separateconnection fixing unit may be provided, and the connection fixing unitmay be changed in connectable other types.

The sub-light source modules 101-1 to 101-n (n represents naturalnumbers greater than 1, n>1) may have a shape in which a fixed partprotrudes. However, the shape is not limited to this. The sub-lightsource modules may be implemented in various shapes. For example, whenlooking down the sub-light source modules 101-1 to 101-n (n representsnatural numbers greater than 1>1) from the above, the shape thereof maybe a circular shape, an elliptical shape a polygonal shape, and a shapein which a part protrudes in a side direction.

For example, one end of the first sub-light source module 101-1 mayinclude a protrusion part 540 in a center thereof. The first connector510 may be provided to the flexible printed circuit board 10corresponding to the protrusion part 540. The first connection fixingunit 410-1 may be provided to the resin layer 40 of a remaining part ofthe one end of the first sub-light source module 101-1 except for theprotrusion part 540.

Also, one end of the second sub-light source module 101-2 may have agroove part 545 in a center thereof, the second connector 520 may beprovided in the flexible printed circuit board 10 corresponding to thegroove part 545, and the first connection fixing unit 420-1 may beprovided to the resin layer 40 of the remaining part of one end of thesecond sub-light source 101-2 except for the groove part 545.Furthermore, another end of the second sub-light source module 101-2 mayinclude a protrusion part 560 in its center, the third connector 530 maybe provided in the flexible printed circuit board 10 corresponding tothe protrusion part 560, and the second connection fixing unit 420-2 maybe provided to the resin layer 40 of the remaining part of one end ofthe second sub-light source 101-2 except for the protrusion part 560.

Each of the sub-light source modules 101-1 to 101-n may be anindependent light source, and a shape thereof may be variously changed.Since two or more sub-light source modules may be assembled to eachother by the connection fixing unit, and thus may be used as theindependent light source, the present exemplary embodiment can improve adegree of freedom in product design. Also, in the present exemplaryembodiment, in a case where some parts of the assembled sub-light sourcemodules are damaged or broken, only the damaged sub-light source modulemay be exchanged and used.

The aforesaid light source module may be used in a display device, anindicating device and a lighting system which require a surface lightsource. In particular, it is advantageous that the light source moduleaccording to some exemplary embodiment may be easily mounted in a place(e.g. a ceiling or a bottom having a bend) in which illumination isrequired, but installation of the illumination cannot be easilyperformed because a part for mounting the illumination has a bend. Forexample, the lighting system may include a lamp or a streetlamp. Thelamp may be a head lamp for a vehicle. However, the lamp is not limitedto this.

FIG. 21 shows a head lamp for a vehicle 900-1 according to an exemplaryembodiment, and FIG. 43 shows a general head lamp for a vehicle, which apoint light source. Referring to FIG. 21, the head lamp for the vehicle900-1 includes a light source module 910 and a light housing 920.

The light source module 910 may be shown in the aforesaid exemplaryembodiments 100-1 to 100-12. The light housing 920 may receive the lightsource module 910 and may be composed of a transparent material. Thelight housing 920 for a vehicle may include a bend depending on aportion and design of the vehicle which is mounted. Meanwhile, asdescribed above, the diffusion plate itself may perform a function ofthe light housing 920 for the vehicle. In addition to the diffusionplate, the separate light housing 920 for the vehicle may be provided,which is the same as previously described. The light source module 910itself has flexibility because it uses the flexible printed circuitboard 10 and the resin layer 40, so the light source module 910 may beeasily mounted to the light housing for the vehicle 920 having the bend.Also, since the light source modules 100-1 to 100-12 has a structure inwhich heat dissipation efficiency is improved, the head lamp for thevehicle 900-1 according to the present exemplary embodiment may inhibitthe generation of wavelength shift and the reduction of luminousintensity. Also, as described above, the separate light reflectionmember is formed on the side surface of the resin layer, so light losscan be reduced and the improvement of brightness compared to sameelectric power can be implemented.

Since the general head lamp for the vehicle as illustrated in FIG. 43 isa point light source, when it emits light, a spot 930 may be partiallygenerated from a light emitting surface. However, since the head lampfor the vehicle 900-1 according the present exemplary embodiment is asurface light source, the spot cannot be generated and uniformbrightness and roughness can be implemented all over the light emittingsurface.

FIG. 22 shows a perspective view of the light emitting device package200-1 according to the first exemplary embodiment, FIG. 23 shows anupper view of the light emitting device package 200-1 according to thefirst exemplary embodiment, FIG. 24 shows a front view of the lightemitting device package 200-1 according to the first exemplaryembodiment, and FIG. 25 shows a side view of the light emitting devicepackage 200-1 according to the first exemplary embodiment.

The light emitting device package 200-1 illustrated in FIG. 22 may be alight emitting device package included in the light source moduleaccording to the aforesaid exemplary embodiments. However, the lightemitting device package is not limited to this.

Referring to FIG. 22 to FIG. 25, the light emitting device package 200-1includes a package body 610, a first lead frame 620, a second lead frame630, a light emitting chip 640, a zener diode 645 and a wire 650-1.

The package body 610 may be formed of a substrate having a goodinsulating property or heat conductivity such as a wafer level packagebased on silicon, a silicon substrate, a silicon carbide (SiC), aluminumnitride (AlN) and the like and may have a structure in which a pluralityof substrates is laminated. However, the present exemplary embodiment isnot limited to the aforesaid material, structure and shape of the body.

For example, a length (X1) of a first direction (e.g. an X-axisdirection) of the package body 610 may be 5.95 mm to 6.05 mm, and alength (Y1) of a second direction (e.g. a Y-axis direction) may be 1.35mm to 1.45 mm. A length (Y2) of a third direction (e.g. a Z-axisdirection) of the package body 610 may be 1.6 mm to 1.7 mm. For example,the first direction may be a parallel direction to a long side of thepackage body 610.

The package body 610 may have a cavity 601, an upper part of which isopen, and which is composed of a side wall 602 and a bottom 603. Thecavity 601 may be formed in a cup shape, a concave container shape andthe like. The side wall 602 of the cavity 601 may be vertical or slantedto the bottom 603. When looking down the cavity 601 from the above, ashape thereof may be a circular shape, an elliptical shape, asemi-circular shape and a polygonal shape (e.g. a quadrilateral shape).A corner part of the cavity 601 which is a polygonal shape may be acurved line. For example, a length (X3) of the first direction (e.g. theX-axis direction) of the cavity 601 may be 4.15 mm to 4.25 mm, a length(X4) of the second direction (e.g. the Y-axis direction) may be 0.64 mmto 0.9 mm, and a depth (Y3, the length of the Z-axis direction) of thecavity 601 may be 0.33 mm to 0.53 mm.

In consideration of heat dissipation or mounting of the light emittingchip 640, the first lead frame 620 and the second lead frame 630 may bedisposed on a surface of the package body 610 to be electricallyseparated from each other. The light emitting chip 640 may beelectrically connected to the first lead frame 620 and the second leadframe 630. The number of the light emitting chip 640 may be one or more.

The reflection member (not drawn) for reflecting light emitted from thelight emitting chip 640 to be toward a predetermined direction may beprovided to a side wall of the cavity of the package body 610.

The first lead frame 620 and the second lead frame 630 may be disposedin an upper surface of the package body 610 to be spaced apart from eachother. A part (e.g. the bottom 603 of the cavity 601) of the packagebody 610 may be located between the first lead frame 620 and the secondlead frame 630 so that the first lead frame and the second lead framemay be electrically separated from each other.

The first lead frame 620 may include on one end (e.g. 712) exposed tothe cavity 601, and another end (e.g. 714) exposed to one surface of thepackage body 610 by passing through the package body 610. Also, thesecond lead frame 630 may include on one end (e.g. 744-1) exposed to oneside of the one surface of the package body 610, another end (e.g.744-2) exposed to another side of the one surface of the package body610, and a middle part (e.g. 742-2) exposed to the cavity 601.

A separation distance (X2) between the first lead frame 620 and thesecond lead frame 630 may be 0.1 mm to 0.2 mm. The upper surface of thefirst lead frame 620 and the upper surface of the second lead frame 630may be located on the same plane as the bottom 603 of the cavity 601.

FIG. 26 shows a perspective view of the first lead frame 620 and thesecond lead frame 630 illustrated in FIG. 22, FIG. 27 is a view forexplaining a size of each part of the first lead frame 620 and thesecond lead frame illustrated in FIG. 26, and FIG. 28 is an enlargedview of connection parts 732, 734, 736 of the first lead frame 620 whichis adjacent to a boundary part 801 between a first side surface part714, and a first upper surface part 712 illustrated in FIG. 27.

Referring to FIG. 26 to FIG. 28, the first lead frame 620 includes thefirst upper surface part 712, and the first side surface part 714 whichis bent from the first side surface part of the first upper surface part712.

The first upper surface part 712 may be located on a same plane as thebottom of the cavity 601, may be exposed by the cavity, and may disposelight emitting chips 642, 644.

As illustrated in FIG. 27, both ends of the first upper surface part 712may have a part (S3) which protrudes in the first direction (the X-axisdirection) based on the first side surface part 714. The protruding part(S3) of the first upper surface part 712 may be a part which supportsthe first lead frame in a lead frame array. A length of a firstdirection of the protruding part (S3) of the first upper surface part712 may be 0.4 mm to 0.5 mm. A length (K) of a first direction of thefirst upper surface part 712 may be 3.45 mm to 3.55 mm, and a length(J1) of a second direction may be 0.6 mm to 0.7 mm. In an xyz coordinatesystem, the first direction may be the X-axis direction, and the seconddirection may be the Y-axis direction.

A second side portion of the first upper surface part 712 may have atleast one groove part 701. At this time, the second side portion of thefirst upper surface part 712 may be opposite to a first side portion ofthe first upper surface part 712. For example, the second side portionof the first upper surface part 712 may have one groove part 701 in itsmiddle. However, the present invention is not limited to this. Thenumber of the groove part formed in the second side portion may be twoor more. The groove part 701 may have a shape corresponding to aprotrusion part 702 provided to the second lead frame 630 which will bedescribed later.

The groove part 701 illustrated in FIG. 27 may have a trapezoidal shape.However, the shape is not limited to this. The groove part 701 may beimplemented in various shapes such as a circular shape, a polygonalshape, an elliptical shape and the like. A length (S2) of a firstdirection of the groove part 701 may be 1.15 mm to 1.25 mm, and a length(S1) of a second direction of the groove part 701 may be 0.4 mm to 0.5mm.

Also, an angle (θ1) between a bottom 701-1 and a side surface 701-2 ofthe groove part 701 may be larger than or equal to 900 and may besmaller than 180°. The light emitting chips 642, 644 may be disposed onthe first upper surface part 712 of both sides of the groove part 701.

The first side surface part 714 may be bent in a predetermined anglefrom the first side portion of the first upper surface part 712 to alower direction. The first side surface part 714 may be exposed from oneside surface of the package body 610. For example, the angle between thefirst upper surface part 712 and the first side surface part 714 may belarger than or equal to 90° and may be smaller than 180°.

The first lead frame 620 may have at least one or more through holes 720in at least one of the first upper surface part 712 and the first sidesurface part 714. For example, the first lead frame 620 may have one ormore through holes 720 to be adjacent to a boundary part between thefirst upper surface part 712 and the first side surface part 714. FIG.24 illustrates two through holes 722, 724 which are spaced apart fromeach other to be adjacent to the boundary part between the first uppersurface part 712 and the first side surface part 714. However, thepresent exemplary embodiment is not limited to this.

One or more through holes 720 may be formed in each one region of thefirst upper surface part 712 and the first side surface part 714 whichare adjacent to the boundary portion between the first upper surfacepart 712 and the first side surface part 714. At this time, a throughhole (e.g. 722-1) formed in the one region of the first upper surfacepart 712 and a through hole (e.g. 722-2) formed in the one region of thefirst side surface part 714 may be connected to each other.

A part of the package body 610 is filled in the through hole 720,thereby enabling the degree of coupling of the first lead frame 620 andthe package body to be improved. Also, the through hole 720 may functionto easily form the bending between the first upper surface part 712 andthe first side surface part 714. However, when a size of the throughhole 720 is too large, or the number of through holes is too much, thefirst upper surface part 712 and the first side surface part 714 may bedisconnected at the time of bending the first lead frame 620. Thus, thesize and the number of the through hole 720 should be appropriatelyadjusted. Also, since the size of the through hole 720 has relevance toeach size of the connection parts 732, 734, 736 which will be statedlater, it also has relevance to heat dissipation of heat of the lightemitting device package.

The exemplary embodiments according to each size of the first lead frame620 and the second lead frame 630 having through holes, which will behereinafter stated, may have optimal heat dissipation efficiency inconsideration of the degree of coupling and the easiness of bending.

In order to improve the degree of coupling with the package body 610,and to inhibit damage from being generated upon the bending while easilyperforming the bending of the first lead frame 620, the presentexemplary embodiment may have a first through hole 722 and a secondthrough hole 724. A length (D11) of a first direction of the firstthrough hole 722, and a length (D12) of a first direction of the secondthrough hole 724 (D12) may be 0.58 mm to 0.68 mm, and a length (D2) of asecond direction may be 0.19 mm to 0.29 mm. An area of the first throughhole 722 may be identical to that of the second through hole 724.However, the area is not limited to this. Their areas may be differentfrom each other.

Referring to FIG. 28, the first lead frame 620 may be located to beadjacent to the boundary portion 801 between the first upper surfacepart 712 and the first side surface part 714, and may have theconnection parts 732, 734, 736 which are spaced apart from each other bythe through hole 720 and which connect the first upper surface part 712and the first side surface part 714 to each other. For example, therespective connection parts 732, 734, 736 may be composed of a firstportion 732-1, 734-1 or 736-1 corresponding to a part of the first uppersurface part 712, and a second portion 732-2, 734-2 or 736-2corresponding to a part of the first side surface part 714. The throughhole 720 may be located among the respective connection parts 732, 734,736.

The first lead frame 620 may have at least one connection part which islocated to correspond to or to be aligned in the light emitting chip 642or 644.

Specifically, the first lead frame 620 may include the first to thirdconnection parts 732, 734, 736. The first connection part 732 may belocated to correspond to or to be aligned in the first light emittingchip 642, and the second connection part 734 may be located tocorrespond to or to be aligned in the second light emitting chip 644.Furthermore, the third connection part 736 may be located between thefirst connection part 732 and the second connection part 734 and may bea part which is not aligned in the first light emitting chip 642 or thesecond light emitting chip 644. For example, the third connection part736 may be located to correspond to or to be aligned in the groove part701 of the first lead frame 620. However, the present invention is notlimited to this.

A length (C11) of a first direction of the first connection part 731 anda length (C2) of a first direction of the second connection part 734 maybe larger than a length (E) of a first direction of the third connectionpart 736. For example, the length (C11) of the first direction of thefirst connection part 731 and the length (C2) of the first direction ofthe second connection part 734 may be 0.45 mm to 0.55 mm, and the length(E) of the first direction of the third connection part 736 may be 0.3mm to 0.4 mm. The reason why the third connection part 736 is locatedbetween the first through hole 722 and the second through hole 724 is toinhibit disconnection between the first upper surface part 712 and thefirst side surface part 714 at the time of bending.

A ratio of the length (E) of the first direction of the third connectionpart 736 to the length (C11) of the first direction of the firstconnection part 731 may be 1 to 1.2˜1.8. The ratio of a length (D11 orD12) of a first direction of the through hole 722 to a length (B1) of afirst direction of an upper end portion 714-1 of the first side surfacepart 714 may be 1 to 3.8˜6.3.

Since the first connection part 732 is aligned in a first light emittingchip 642, and the second connection part 734 is aligned in a secondlight emitting chip 644, heat generated from the first light emittingchip 642 may be mainly emitted through the first connection part 732 tothe outside, and heat generated from the second light emitting chip 644may be mainly emitted through the second connection part 734 to theoutside.

In the present exemplary embodiment, since each length (C11, C2) of thefirst directions of the first connection part 732 and the secondconnection part 734 is larger than the length (E) of the first directionof the third connection part 736, each area of the first connection part732 and the second connection part 734 is larger than an area of thethird connection part 736. Accordingly, in the present exemplaryembodiment, efficiency for emitting the heat generated from the firstlight emitting chip 642 and the second light emitting chip 644 to theoutside can be improved by increasing each area of the connection parts732, 734 disposed to be adjacent to the light source 20.

The first side surface part 714 may be divided into the upper endportion 714-1 connected to the first upper surface part 712, and a lowerend portion 714-2 connected to the upper end portion 714-1. That is, theupper end portion 714-1 may include each one part of the first to thirdconnection parts 732, 734, 736, and the lower end portion 714-2 may belocated below the upper end portion 714-1.

A length (F1) of a third direction of the upper end part (714-1) may be0.6 mm to 0.7 mm, and a length (F2) of a third direction of the lowerend part (714-2) may be 0.4 mm to 0.5 mm. The third direction may be theZ-axis direction in the xyz coordinate system.

To improve the degree of coupling with the package body 620 andairtightness for inhibiting the penetration of water, a side of theupper end portion 714-1 and a side of the lower end portion 714-2 mayhave a step pulley. For example, both side ends of the lower end portion714-2 may have a shape which protrudes to a side direction based on theside surface of the upper end portion 714-1. A length (B1) of a firstdirection of the upper end portion 714-1 may be 2.56 mm to 2.66 mm, anda length (B2) of a first direction of the lower end portion 714-2 may be2.7 mm to 3.7 mm. A thickness (t1) of the first lead frame 620 may be0.1 mm to 0.2 mm.

The second lead frame 630 may be disposed to surround around any oneside portion of the first lead frame 620. For example, the second leadframe 630 may be disposed around remaining side portions except for thefirst side surface part 714 of the first lead frame 630.

The second lead frame 630 may include a second upper surface part 742and a second side surface part 744. The second upper surface part 742may be disposed to surround around the remaining side portions exceptfor the first side portion of the first upper surface part 712. Asillustrated in FIG. 24 and FIG. 28, the second upper surface part 742may be located on the same plane as the bottom of the cavity 601 and thefirst upper surface part 712, and may be exposed by the cavity 601. Athickness (t2) of the second lead frame 630 may be 0.1 mm to 0.2 mm.

The second upper surface part 742 may be divided into a first part742-1, a second part 742-2 and a third part 742-3 depending on alocation which surrounds around the first upper surface part 712. Thesecond part 742-2 of the second upper surface part 742 may be a partcorresponding to or facing the second side portion of the first uppersurface part 712. The first part 742-1 of the second upper surface part742 may be connected to one end of the second part 742-2 and maycorrespond to or face any one of the remaining side portions of thefirst upper surface part 712. The third part 742-3 of the second uppersurface part 742 may be connected to another end of the second part742-2 and may correspond to or face any another one of the remainingside portions of the first upper surface part 712.

A length (H1) of a second direction of the first part 742-1 and thethird part 742-3 may be 0.65 mm to 0.75 mm, and a length (H2) of a firstdirection may be 0.78 mm to 0.88 mm. A length (I) of a first directionof the second part 742-2 may be 4.8 mm to 4.9 mm.

The second part 742-2 of the second upper surface part 742 may have theprotrusion part 702 corresponding to the groove part 701 of the uppersurface part 742-2. For example, a shape of the protrusion part 702 maybe consistent with that of the groove part 701. The protrusion part 702may be located to be aligned in the groove part 701. Also, theprotrusion part 702 may be located in the groove part 701. The number ofthe protrusion part 702 may be identical to that of the groove part 701.The protrusion part 702 and the groove part 701 may be spaced apart fromeach other. A part of the package body 610 may be located therebetween.The protrusion part 702 is an area for wire-bonding of the first lightemitting chip 642 and the second light emitting chip 644 and is locatedto be aligned between the first light emitting chip 642 and the secondlight emitting chip 644, thereby enabling the wire-bonding to be easilyperformed.

A length (S5) of a first direction of the protrusion part 702 may rangefrom 0.85 mm to 0.95 mm, and a length (S4) of a second direction mayrange from 0.3 mm to 0.4 mm. An angle (02) between the protrusion part702 and the second part (742-2) may be more than or equal to 90°, andmay be smaller than 180°.

The second side surface part 744 may be bent from at least one sideportion of the second upper surface part 742. The second side surfacepart 744 may be bent in a predetermined angle (e.g. 90°) from the secondupper surface part 742 to a lower direction.

For example, the second side surface part 744 may include the firstportion 744-1 which is bent from one side portion of the first portion742-1 of the second upper surface part 742, and a second portion 744-2which is bent from one side portion of the third portion 742-3 of thesecond upper surface part 742.

The first portion 744-1 and the second portion 744-2 of the second sidesurface part 744 may be bent to be located in the same side surface inthe second lead frame 630. The first portion 744-1 of the second sidesurface part 744 may be spaced apart from the first side surface part714 and may be located at one side (e.g. a left side) of the first sidesurface part 714. The second portion 744-2 of the second side surfacepart 744 may be spaced apart from the first side surface part 714 andmay be located at another side (e.g. a right side) of the first sidesurface part 714. The first side surface part 714 and the second sidesurface part 744 may be located in one plane. After all, as illustratedin FIG. 24, the first side surface part 714 and the second side surfacepart 744 may be exposed to the same side surface of the package body610. A length (A) of a first direction of the second side surface part744 may range from 0.4 mm to 0.5 mm, and a length (G) of a thirddirection thereof may range from 1.05 mm to 1.15 mm.

One side surface of the first portion 742-1 and the third portion 742-3of the second upper surface part 742 may have a bending step pulley(g1). For example, the bending step pulley (g1) may be located to beadjacent to a portion in which one side surface of the first portion742-1 of the second upper surface part 742 meets one side surface of thefirst portion 744-1 of the second side surface part 744. As much as thebending step pulley (g1), each area of the first upper surface part 712and the first side surface part 714 located to correspond thereto may bewidely designed, so the present exemplary embodiment can improve heatdissipation efficiency due to an increase in heat dissipation area. Thisis because the area of the first lead frame 620 has relevance to heatdissipation of the light emitting chips 642, 644.

Another side surface of third portion 742-3 and the first portion 742-1of the second upper surface part 742 may have a bending step pulley(g2). The reason why the bending step pulley (g2) is formed is to easilyobserve a bonding material (e.g. a solder) with the naked eye.

The first side surface part 714 of the first lead frame 620 and thesecond side surface part 744 of the second lead frame 630 may be mountedto be in contact with the flexible printed circuit board 10 of the lightsource modules 100-1 to 100-21 according to the exemplary embodiment.Due to this, the light emitting chip 640 may irradiate light in adirection 3 which is toward the side surface of the resin layer 40. Thatis, the light emitting device package 200-1 may have a side view typestructure.

To improve a withstand voltage of the light emitting device package200-1, the zener diode 645 may be disposed on the second lead frame 630.For example, the zener diode 645 may be disposed on the second uppersurface part 742 of the second lead frame 630.

The first light emitting chip 642 may be electrically connected to thesecond lead frame 630 by a first wire 652. The second light emittingchip 644 may be electrically connected to the second lead frame 630 by asecond wire 654. The zener diode 645 may be electrically connected tothe first lead frame 620 by a third wire 656.

For example, one end of the first wire 652 may be connected to the firstlight emitting chip 642 and another end may be connected to theprotrusion part 702. Also, one end of the second wire 654 may beconnected to the second light emitting chip 644 and another end may beconnected to the protrusion part 702.

The light emitting device package 200-1 may further include the resinlayer (not drawn) which is filled in the cavity 601 so as to surroundthe light emitting chip. The resin layer may be composed of a colorlesstransparent polymer resin material such as epoxy or silicon.

The light emitting device package 200-1 may implement red light usingonly a red light emitting chip without using a fluorescent substance.However, the present exemplary embodiment is not limited to this. Theresin layer may include the fluorescent substance so that the wavelengthof light emitted from the light emitting chip 640 can be changed. Forexample, although a light emitting chip having other colors rather thanthe red color is used, the light emitting device package which emitslight having a desired color may be implemented by changing thewavelength of light using the florescent substance.

FIG. 29 shows the first lead frame 620-1 and the second lead frame 630according to still another exemplary embodiment. The same referencenumerals as those of FIG. 26 represent the same elements, and thecontents overlapping with those stated earlier are omitted or arebriefly stated.

Referring to FIG. 29, the first lead frame 620-1 may have a structure inwhich the third connection part 736 is removed from the first lead frame620 illustrated in FIG. 26. That is, the first lead frame 620-1 may haveone through hole 720-1 to be adjacent to a boundary part between thefirst upper surface part 712 and a first side surface part 714′.Furthermore, the first connection part 732 may be located at one side ofthe through hole 720-1, and the second connection part 734 may belocated at another side of the through hole 720-1.

FIG. 30 shows a first lead frame 620-2 and a second lead frame 630-1according to still another exemplary embodiment. The same referencenumerals as those of FIG. 26 represent the same elements, and thecontents overlapping with those stated earlier are omitted or arebriefly stated.

Referring to FIG. 30, a first upper surface part 712′ of the first leadframe 620-2 may have a structure in which the groove part 701 is omittedfrom the first upper surface part 712 of the first lead frame 620illustrated in FIG. 30. Furthermore, the second portion 742-2′ of thesecond upper surface part 742′ of the second lead frame 630-1 may have astructure in which the protrusion part 702 is omitted from the secondportion 742-2 of the second upper surface part 742 of the second leadframe illustrated in FIG. 30. The remaining elements except for this maybe identical to those as explained in FIG. 26.

FIG. 31 shows a first lead frame 620-3 and the second lead frame 630according to still another exemplary embodiment. The same referencenumerals as those of FIG. 26 represent the same elements, and thecontents overlapping with those stated earlier are omitted or arebriefly stated.

Referring to FIG. 31, the first lead frame 620-3 may have a structure inwhich minute through holes h1, h2, h3 passing through the first leadframe 620 are formed in at least one of the connection parts 732, 734,736 of the first lead frame illustrated in FIG. 26.

At least one of the connection parts 732-1, 734-1, 736-1 of the firstlead frame 620-3 may have the minute through holes h1, h2, h3 which areformed in the boundary portion between the first upper surface part 712and the first side surface part 714. At this time, each diameter of theminute through holes h1, h2, h3 may be smaller than the lengths (D11,D12) of the first direction of the through holes 722, 724 or the lengthof the second direction. Also, the number of the minute through holesh1, h2 formed in the first connection part 732-1 and the secondconnection part 734-1 may be larger than that of the minute through holeh3 formed in the third connection part 736-1. However, the presentinvention is not limited to this. Also, each shape of the minute throughholes h1, h2, h3 may be a circular shape, an elliptical shape or apolygonal shape. The minute through holes h1, h2, h3 may enable thebending of the first lead frame 620-3 to be easily performed and mayimprove a binding force between the first lead frame 620-3 and thepackage body 610.

FIG. 32 shows a first lead frame 620-4 and the second lead frame 630according to still another exemplary embodiment. The same referencenumerals as those of FIG. 26 represent the same elements, and thecontents overlapping with those stated earlier are omitted or arebriefly stated.

Referring to FIG. 32, the first lead frame 620-4 may include a firstupper surface part 712″ and a first side surface part 714″. The firstupper surface part 712″ and the first side surface part 714″ aremodified examples of the first upper surface part 712 and the first sidesurface part 714 illustrated in FIG. 30. That is, the first lead frame620-4 The first lead frame 620-4 may have a structure in which thethrough holes 722, 724 are omitted from the first upper surface part 712and the first side surface part 714 of the first lead frame 620illustrated in FIG. 24, and the plurality of minute through holes (h4)spaced apart from each is provided in one region (Q2) of a boundaryportion (Q) between the first upper surface part 712″ and the first sidesurface part 714″ in which the through holes 722, 724 are omitted.

The boundary portion (Q) between the first upper surface part 712″ andthe first side surface part 714″ may be divided into a first boundaryregion (Q1), a second boundary region (Q2), and a third boundary region(Q3). The first boundary region (Q1) may be a region which correspondsto or is aligned in the first light emitting chip 642. The secondboundary region (Q2) may be a region which corresponds to or is alignedin the first light emitting chip 642. The third boundary region (Q3) maybe a region between the first boundary region (Q1) and the secondboundary region (Q2). For example, the first boundary region (Q1) may bea region corresponding to the first connection part 732. The secondboundary region (Q2) may be a region corresponding to the secondconnection part 734 illustrated in FIG. 26.

The first boundary region (Q1) and the second boundary region (Q2) mayfunction as a path for transmitting heat from the first light emittingchip 642 and the second light emitting chip 644, and the plurality ofminute through holes (h4) may enable the bending between the first uppersurface part 712″ and the first side surface part 714″ to be easilyperformed. In FIG. 30, the plurality of minute through holes (h4) isidentical to each other with respect to a diameter and a separationdistance. However, the present exemplary embodiment is not limited tothis. In still another exemplary embodiment, at least one of theplurality of minute through holes (h4) may have a different diameter ora different separation distance.

FIG. 33 shows the first lead frame 620 and a second lead frame 630-2according to still another exemplary embodiment. The second lead frame630-2 of FIG. 33 may be a modified example of the second lead frame 630illustrated in FIG. 24. The same reference numerals as those of FIG. 26represent the same elements, and the contents overlapping with thosestated earlier are omitted or are briefly stated.

Referring to FIG. 33, unlike the second portion 742-2 of the secondupper surface part 742 illustrated in FIG. 26, the second portion 742-2″of the second upper surface part 742″ illustrated in FIG. 33 has adisconnection structure, and does not connect the first portion 742-1and the third portion 742-3.

The second upper surface part 742″ of the second lead frame 630-2 mayinclude the first portion 742-1, the second portion 742-2″, and thethird portion 742-3. Each of the first to third portions 742-1, 742-2″,742-3 may be located around corresponding one of the side portions ofthe first upper surface part 712 of the first lead frame 620.

The second portion 742-2″ of the second upper surface part 742″ may becomposed of a first region 704 connected to the first part 742-1, asecond region 705 connected to a third part 742-3 and spaced apart fromthe first region 704. Since the package body 610 is filled in aseparation space 706 between the first region 704 and the second region705, a binding force between the package body 610 and the second leadframe 630-2 can be improved. The second lead frame 630-2 illustrated inFIG. 34 may be divided into the first sub-frames 744-1, 742-1, 704 andthe second sub-frames 744-2, 742-3, 705 which may be electricallyseparated from each other.

FIG. 34 shows a first lead frame 810 and a second lead frame 820according to still another exemplary embodiment.

Referring to FIG. 34, the first lead frame 810 may include a first uppersurface part 812, a first side surface part 814 and a second sidesurface part 816 which are bent from the first upper surface part 812.The light emitting chips 642, 644 may be disposed in the first uppersurface part 812.

The second side portion of the first upper surface part 812 may have oneor more first groove parts 803, 804 and a first protrusion part 805. Atthis time, the second side portion of the first upper surface part 812may be a side portion which is opposite to the first side portion of thefirst upper surface part 812. For example, the second side portion ofthe first upper surface part 812 may have two first groove parts and onefirst protrusion part 805 which is located between the first grooveparts 803, 804. However, the present invention is not limited to this.The first groove parts 803, 804 may have a shape corresponding to thesecond protrusion parts 813, 814 provided in the second lead frame whichwill be described later, and the first protrusion part 805 may have ashape corresponding to the second groove part 815 provided in the secondlead frame. The first groove parts 803, 804 and the first protrusionpart 805 illustrated in FIG. 32 may have a quadrilateral shape. However,the shape is not limited to this. They may be implemented in variousshapes such as a circular shape, a polygonal shape, an elliptical shapeand the like. The light emitting chips 642, 644 may be disposed on thefirst upper surface part of both sides of the first groove parts 803,804.

The first side surface part 814 may be connected to one region of thefirst side portion of the first upper surface part 712, the second sidesurface part 816 may be connected to another region of the first sideportion of the first upper surface part 712, and the first side surfacepart 814 and the second side surface part 816 may be spaced apart fromeach other. The first side surface part 814 and the second side surfacepart 816 may be exposed from any same one side surface of the packagebody 610.

The first lead frame 610 may have one or more through holes 820 in atleast one of the first upper surface part 812 and the first side surfacepart 814. For example, the first lead frame 810 may have one or morethrough holes to be adjacent to a boundary portion between the firstupper surface part 812 and the first side surface part 814. The throughhole 820 may have the same structure as that stated in FIG. 26 and FIG.28, and the function thereof may also be identical to that stated inFIG. 26 and FIG. 28.

The first lead frame 810 may be located to be adjacent to the boundaryportion 801 between the first upper surface part 812 and the first sidesurface part 814 and may have connection parts 852, 854, 856 which arespaced apart from each other by the through hole 720, and which connectthe first upper surface part 712 and the first side surface part 714 toeach other. The structure and function of the connection parts 852, 854,856 may be identical to those stated in FIG. 26 and FIG. 28. The firstlead frame 810 may have at least one connection part which correspondsto or is located to be adjacent to the light emitting chip 642 or 644.

A length of a first direction of the connection part (e.g. 852, 854)which corresponds to or is located to be adjacent to the light emittingchip 642, 644 may be larger than a length of a first direction of theconnection part (e.g. 856) which does not correspond to or is notadjacent to the light emitting chip 642, 644.

To improve a binding force with the package body 620 and airtightnessfor inhibiting the penetration of water, a lower end portion of a sidesurface of the second side surface part 814 may protrude in a sidedirection.

The second lead frame 820 may be disposed around at least one sideportion of the first lead frame 810. The second lead frame 820 mayinclude a second upper surface part 822 and a third side surface part824. The second upper surface part 822 may be divided into a firstportion 832 and a second portion 834 depending on a location disposedaround the first upper part 812.

The second portion 834 of the second upper surface part 822 may be apart which corresponds to or is opposite to the second side portion ofthe first upper surface part 812. The first portion 832 of the secondupper surface part 822 may be connected to one end of the second portion834 and may correspond to or be opposite to the third side portion ofthe first upper surface part 712. The third side portion may be a sideportion which is vertical to the first side portion or the second sideportion.

The second portion 834 of the second upper surface part 822 may have thesecond protrusion parts 813, 814 corresponding to the first groove parts803, 804 of the first upper surface part 812. The second protrusionparts 813, 814, which are a region for the wire-bonding of the firstlight emitting chip 642 and the seconding light emitting chip 644, maybe located between the first light emitting chip 642 and the secondlight emitting chip 644, thereby enabling the wire-bonding to be easilyperformed.

The third side surface part 824 may be bent in a predetermined angle(e.g. 90°) from the second upper surface part 822 to the lowerdirection. For example, the third side surface part 824 may be bent fromone side portion of the first portion of the second upper side part.Based on the first side surface part 814, the second side surface part816 and the third side surface part may have a bilateral symmetricalshape. To improve a binding force with the package body 620 andairtightness for inhibiting the penetration of water, a lower endportion of the third side surface part 824 may protrude in the sidedirection. The first side surface part 814, the second side surface part861 and the third side surface part 824 may be exposed to the same sidesurface as the package body 610.

FIG. 35 shows a perspective view of a light emitting device package200-2 according to another exemplary embodiment of the presentinvention, FIG. 36 shows an upper view of the light emitting devicepackage illustrated in FIG. 35, FIG. 37 shows a front view of the lightemitting device package illustrated in FIG. 35, FIG. 38 shows across-sectional view taken along cd of the light emitting device packageillustrated in FIG. 35, and FIG. 39 shows the first lead frame 620′ andthe second lead frame 630′ illustrated in FIG. 35. The same referencenumerals as those of FIG. 22 to FIG. 26 represent the same elements, andthe contents overlapping with those stated earlier are omitted or arebriefly stated.

Referring to FIG. 35 to FIG. 39, the first lead frame 620′ of the lightemitting device package 200-2 may include a first upper surface part 932and a first side surface part 934. Unlike the first upper surface part712 illustrated in FIG. 26, the first upper surface part 932 illustratedin FIG. 39 has no groove part. The second upper surface part 942 of thesecond lead frame 630′ may be similar to the structure in which thesecond portion 742-2 of the second upper surface part 742 illustrated inFIG. 30 is omitted.

The first side surface part 934 may have the same structure as that ofthe first side surface part 714 illustrated in FIG. 32. A length (P1) ofa first direction of the first upper surface part 932 may be smallerthan that of the first upper surface part 712 illustrated in FIG. 28. Alength (J2) of a second direction of the first upper surface part 932may be larger than that (J1) of the second direction of the first uppersurface part 712. For example, the length (P1) of the first direction ofthe first upper surface part 932 may range from 4.8 mm to 4.9 mm. Thelength (J2) of the second direction may range from 0.67 mm to 0.77 mm.Accordingly, since an area of the first upper surface part 932illustrated in FIG. 35 is larger than the area of the first uppersurface part 712 illustrated in FIG. 30, the exemplary embodiment ofFIG. 35 may mount a light emitting chip having a larger size. Each sizeof the first side surface part 944, the through holes 722, 724, and theconnection parts may be identical to those explained in FIG. 27.

The second lead frame 630′ may include the second upper surface part 942and the second side surface part 944. The second upper surface part 942may include a first portion 942-1 disposed around a third side portionof the first upper surface part 932, and a second portion 942-2 disposedaround a fourth side portion. The third side portion of the first uppersurface part 932 may be a side portion which is vertical to the firstside portion of the first upper surface part 932, and the fourth sideportion of the first upper surface part 932 may be a side portion whichis opposite to the third side portion of the first upper surface part932.

The first portion 942-1 and the second portion 942-2 of the second uppersurface part 942 may be located to be spaced apart from each other andmay be electrically separated from each other.

The second side surface part 944 may include a first portion 944-1connected to the first portion 942-1 of the second upper surface part942, and a second portion 944-2 connected to the second portion 942-2 ofthe second upper surface part 942. However, a length (P2) of a firstdirection of the first portion 942-1 and the second portion 942-2 of thesecond upper surface part 942 may be larger than the length (H2) of thefirst direction of the first portion 742-1 and the third portion 742-3of the second upper surface part 742 illustrated in FIG. 32.

For example, a length (P2) of a first direction of the first portion942-1 and the second portion 942-2 of the second upper surface part 942may range from 1.04 mm to 1.14 mm, and a length (P3) of a seconddirection may be range from 0.45 mm to 0.55 mm.

In the lead frame array, a length of a first direction of a protrusionpart (S22) of the first upper surface part 932 which protrudes tosupport the first lead frame 620′ may range from 0.14 mm to 0.24 mm.

The first light emitting chip 642 may be electrically connected to thefirst portion 942-1 of the second upper surface part 942 by the firstwire 653. The second light emitting chip 644 may be electricallyconnected to the first portion 942-2 of the second upper surface part942 by the second wire 655.

The first light emitting chip 642 and the second light emitting chip 644may generate light having the same wavelength. For example, the firstlight emitting chip 642 and the second light emitting chip 644 may be ared light emitting chip which generates red light.

Also, the first light emitting chip 642 may generate light havingdifferent wavelengths from each other. For example, the first lightemitting chip 642 may be a red light emitting chip, the second lightemitting chip 644 may be a yellow light emitting chip. The first lightemitting chip 642 and the second light emitting chip 644 mounted to thelight source package according to the second exemplary embodiment may beindividually operated.

A first power source (e.g. a negative (−) power source) may be suppliedto the first lead frame 620′, and a second power source (e.g. a positive(+) power source) may be supplied to the second lead frame 630′. Sincethe second lead frame 630′ is divided into two portions 942-1 & 944-1,and 942-2 & 944-2 which are electrically separated from each other, thefirst lead frame 620′ may be used as a common electrode, and the firstlight emitting chip 642 and the second light emitting chip 644 may beindividually operated by individually supplying the second power sourceto the first portion 942-1 and the second portion 942-2 of the secondupper surface part 942.

Accordingly, when the light emitting device package 200-2 illustrated inFIG. 35 is mounted in the light source modules 100-1 to 100-21 accordingto some exemplary embodiments, the light source modules 100-1 to 100-21may generate surface light sources having various colors. For example,when only the first light emitting chip 642 is operated, some exemplaryembodiment may generate a red surface light source, and when the secondlight emitting chip 644 is operated, some exemplary embodiment maygenerate a yellow surface light source.

FIG. 40 shows measured temperatures of the light emitting devicepackages 200-1, 200-2 according to still another exemplary embodiment.The measured temperature illustrated in FIG. 40 represents a temperatureof the light emitting chip when the light emitting device package emitslight.

Case 1 represents a measured temperature of the light emitting chip whena length of the first direction of the first portion and the secondportion in the side surface part of the first lead frame is identical tothat of the third portion. Case 2 represents a measured temperature ofthe light emitting chip illustrated in FIG. 22. Case 3 represents ameasured temperature of the light emitting chip illustrated in FIG. 33.

Referring to FIG. 40, the measured temperature (t1) of case 1 is 44.54°C., the measured temperature (t2) of case 2 is 43.66° C., and themeasured temperature (t3) of case 3 is 43.58° C.

Accordingly, as designs of the connection parts of the first sidesurface part 714 of the first lead frame 620 are changed, a heatdissipation effect of the present exemplary embodiment can be improved.Thus, since an increase in temperature of the light emitting chip 640mounted to the light emitting device packages 200-1, 200-2 at the timeof light emission may be relieved, the reduction of luminous intensityand the generation of wavelength shift may be inhibited.

FIG. 41 shows one exemplary embodiment of the light emitting chip 640illustrated in FIG. 22. The light emitting chip 640 illustrated in FIG.41 may be a vertical chip which emits red light having a wavelengthrange of 600 nm to 690 nm.

Referring to FIG. 41, the light emitting chip 640 includes: a secondelectrode layer 1801; a reflection layer 1825; a light emittingstructure 1840; a passivation layer 1850; and a first electrode layer1860.

The second electrode layer 1801 along with the first electrode layer1860 may supply a power source to the light emitting structure 1840. Thesecond electrode layer 1801 may include: an electrode material layer1810 for current injection; a support layer 1815 located on theelectrode material layer 1810; and a bonding layer 1820 located on thesupport layer 1815. The second electrode layer 1801 may be bonded to thefirst lead frame of the light emitting device package 200-1 illustratedin FIG. 28, for example, the first supper surface part 712.

The electrode material layer may be Ti/Au, and the support layer 1815may be a metal material or a semiconductor material. Also, the supportlayer 1815 may be a material having high electrical conductivity andheat conductivity. For example, the support layer 1815 may be a metalmaterial including at least one of Cu, a Cu alloy, Au, Ni, Mo, and Cu—Wor may be a semiconductor including at least one of Si, Ge, GaAs, ZnOand SiC.

The bonding layer 1820 may be disposed between the support layer 1815and the reflection layer 1825, and the bonding layer 1820 may functionto bond the support layer to the reflection layer 1825. The bondinglayer 1820 may include at least one of bonding metal materials such asIn, Sn, Ag, Nb, Pd, Ni, Au and Cu. Since the bonding layer 1820 isformed to bond the support layer 1815 using a bonding method, thebonding layer 1820 may be omitted when the support layer 1815 is formedusing a plating method or a deposition method.

The reflection layer 1825 may be disposed on the bonding layer 1820. Thereflection layer 1825 reflects light incident from the light emittingstructure 1840, thereby enabling light extraction efficiency to beimproved. The reflection layer 1825 may be formed of a metal or an alloyincluding at least one of reflection metal materials such as Ag, Ni, Al,Rh, Pd, Ir, Ru, Mg, Zn. Pt, Au, and Hf.

Also, the reflection layer 1825 may be formed in a single layer or multilayers using a conductive oxide layer such as IZO (indium zinc oxide),IZTO (indium zinc tin oxide), IAZO (indium aluminum zinc oxide). IGZO(indium gallium zinc oxide), IGTO (indium gallium tin oxide), AZO(aluminum zinc oxide), ATO (antimony tin oxide) and the like. Also, thereflection layer 1825 may be formed by forming a metal and theconducting oxide such as IZO/Ni, AZO/Ag. IZO/Ag/Ni, AZO/Ag/Ni and thelike in a multiple layer.

An ohmic region 1830 may be located between the reflection layer 1825and the light emitting structure 1840. The ohmic region 1830 which is aregion being in ohmic contact with the light emitting structure 1840,may function to smoothly supply a power source to the light emittingstructure 1840.

The ohmic region 1830 may be formed by putting the light emittingstructure 1840 into ohmic-contact with a material including at least oneof ohmic contact materials such as Be, Au, Ag, Ni, Cr, Ti, Pd, Ir, Sn,Ru, Pt and Hf. For example, the material, which forms the ohmic region1830, may include AuBe and may have a dot shape.

The light emitting structure 1840 may include a window layer 1842, asecond semiconductor layer 1844, an active layer 1846, and a firstsemiconductor layer 1848. The window layer 1842 may be a semiconductorlayer disposed on the reflection layer 1825 and a composition thereofmay be GaP.

The second semiconductor layer 1844 may be disposed on the window layer1842. The second semiconductor 1844 may be implemented in a compoundsemiconductor of Group III to Group V, Group 11 to Group VI and thelike, and a second conductive dopant may be doped. For example, thefirst semiconductor layer 1844 may include any one of AlGaInP, GaInP,GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, andGaAsP, and a p-type dopant (e.g. Mg, Zn, Ca, Sr and Ba) may be doped.

The active layer 1846 may be disposed between the second semiconductorlayer 1844 and the first semiconductor layer 1848, and may generatelight due to energy generated during the recombination process of anelectron and a hole provided from the second semiconductor layer 1844and the first semiconductor layer 1848.

The active layer 1846 may be a compound semiconductor of Group III toGroup V, and Group II to Group VI and may be formed in a single wellstructure, a multiple well structure, a quantum-wire structure, or aquantum dot structure.

For example, the active layer 1846 may have a single or multiple quantumwell structure having a well layer and a barrier layer. The well layermay be a material having a lower band gap than an energy band gap of thebarrier layer. For example, the active layer 1846 may be AlGaInP orGaInP.

The first semiconductor layer 1848 may be formed of a semiconductorcompound. The first semiconductor layer 1848 may be implemented by thesemiconductor of a compound of Group III to Group V, Group II to GroupVI, and the like, and the first conductive dopant may be doped. Forexample, the first semiconductor layer 1848 may include any one ofAlGaInP, GaInP, GaN. AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs,GaP, GaAs, and GaAsP, An n-type dopant (e.g. Si, Ge, Sn, etc.) may bedoped.

The light emitting structure 1840 may generate red light having awavelength range of 600 nm to 690 nm. The first semiconductor layer1848, the active layer 1846 and the second semiconductor layer 1844 mayhave a composition capable of generating red light. To improve lightextraction efficiency, a roughness 1870 may be formed on an uppersurface of the first semiconductor layer 1848.

The passivation layer 1850 may be disposed on a side surface of a lightemitting structure 1840. The passivation layer 1850 may function toelectrically protect the light emitting structure 1840. The passivationlayer 1850 may be formed of an insulating material such as SiO₂,SiO_(x), SiO_(x)N_(y), Si₃N₄, or Al₂O₃. The passivation layer 1850 maybe disposed on at least a part of the upper surface of the firstsemiconductor layer 1848.

The first electrode layer 1860 may be disposed on the firstsemiconductor layer 1848 and may have a predetermined pattern. The firstelectrode layer 1860 may be a single layer or a plurality of layers. Forexample, the first electrode layer 1860 may include a first layer 1862,a second layer 1864 and a third layer 1866 which are sequentiallylaminated. The first layer 1862 may be in ohmic-contact with the firstsemiconductor layer 1848 and may be formed of GaAs. The second layer1864 may be formed of an alloy of AuGe, Ni and Au. The third layer 1866may be formed of an alloy of Ti and Au.

As illustrated in FIG. 22 and FIG. 35, the first electrode layer 1860may be electrically bonded to the second lead frame 630 or 630′ by thewire 652, 654, 653 or 655.

In general, when a temperature of the light emitting chip increases, thewavelength shift is generated and the luminous intensity is reduced.Compared to a blue light emitting chip (i.e. blue LED) generating bluelight and a light emitting chip (i.e. an amber LED) generating yellowlight, a red light emitting chip (i.e. a red LED) generating red lightshows that the wavelength shift and the reduction of luminous intensityare seriously generated depending on an increase in temperature of redlight. Accordingly, in the light emitting device packages and the lightsource modules in which the red LED is used, it is very important toprepare a heat dissipation measure for controlling the increase intemperature of the light emitting chip.

By the way, the light source modules 100-1 to 100-12 and the lightemitting device packages 200-1, 200-2 included in the light device 1according to the exemplary embodiments can improve heat dissipationefficiency as described above. Thus, although the red LED is used, thewavelength shift and the reduction in luminous intensity can becontrolled by controlling the increase in temperature of the lightemitting chip.

FIG. 42 shows a lighting device 2 according to still another exemplaryembodiment. Referring to FIG. 46, the lighting device 2 includes ahousing 1310, a light source module 1320, a diffusion plate 1330 and amicro lens array 1340.

The housing 1310 may receive the light source module 1320, the diffusionplate 1330, and the micro lens array 1340 and may be composed of atransparent material.

The light source module 1320 may be any one of the aforesaid exemplaryembodiments 100-1 to 100-12.

The diffusion plate 1330 may function to uniformly diffuse the lightemitted through the light source 1320 throughout the whole surface. Thediffusion plate 1330 may be composed of the same material as theaforesaid diffusion plate 70. However, the material is not limited tothis. In other exemplary embodiments, the diffusion plate 1330 may beomitted.

The micro lens array 1340 may have a structure in which the plurality ofmicro lenses 1344 is disposed on a base film 1342. Each micro lens 1344may be spaced apart from each other as much as a predetermined distance.A plane surface may exist between the respective micro lenses 1344, andthe respective micro lenses 1344 may be spaced apart from each otherwhile having a pitch of 50 to 500 μm.

In FIG. 42, the diffusion plate 1330 and the micro lens array 1340 arecomposed as separate elements, but other exemplary embodiments, thediffusion plate 1330 and the micro lens array 1340 may be composed in anintegral form.

FIG. 44 shows a tail light for a vehicle 900-2 according to stillanother exemplary embodiment, and FIG. 45 shows a general tail light fora vehicle.

Referring to FIG. 44, the tail light for the vehicle 900-2 may include afirst light source module 952, a second light source module 954, a thirdlight source module 956 and a housing 970.

The first light source module 952 may be a light source for performingthe function of a turn signal light. The second light source module 954may be a light source for performing the function of a sidelight. Thethird light source module 956 may be a light source for performing thefunction of a stoplight. However, the function is not limited to this.The functions may be changed from each other.

The housing 970 may receive the first to third light source modules 952,954, 956 and may be composed of a transparent material. The housing 970may have a bend depending on the design of a vehicle body. At least onelight source module of the first to third light source modules 952, 954,956 may be implemented in any one of the aforesaid exemplary embodiments100-1 to 100-12.

In the case of the tail light, when a vehicle stops, the strength oflight should be more than 110 cd so as to be visible at long range.Generally, compared to this, the strength of light in a level of morethan 30% is required. Furthermore, for light output of more than 30%,the number of the light emitting device packages applied to the lightsource module (e.g. 952, 954 or 956) should be increased up to more than25% to 35%, or the output of each light emitting device package shouldbe increased up to more than 25% to 35%.

When the number of the light emitting device package is increased,difficulty in manufacturing may be generated due to the limitation of anarrangement space. Thus, by increasing the output of each light emittingdevice package mounted to the light source module, the desired strengthof light (e.g. more than 110 cd) can be obtained even with the smallnumber of the light emitting device package. In general, since a valueof multiplying the output (W) of the light emitting device package bythe number (N) thereof becomes a total output of the light sourcemodule, the output and number of the light emitting device packages maybe appropriately determined depending on an area of the light sourcemodule in order to obtain the desired strength of light.

As one example, in the case of a light emitting device package having apower consumption of 0.2 watt and an output of 13 lm, as 37 to 42 lightemitting device packages are disposed a fixed area, the strength oflight of about 100 cd may be obtained. However, in the case of a lightemitting device package having a power consumption of 0.5 watt and anoutput of 30 lm, although 13 to 15 light emitting device packages aredisposed in the same area, the similar strength of light may beobtained. To obtain a fixed output, the number of light emitting devicepackages which should be disposed in a light source module having afixed area may be determined depending on an arrangement pitch, thecontent of a light diffusion material in the resin layer, and a patternshape of the reflection layer. Here, the pitch may be a distance fromany one halfway point of two adjacent light emitting device packages toanother halfway point thereof.

The light emitting device packages are disposed at regular intervalswhen they are disposed in the light source module. In the case of thelight emitting device packages of a high output, the number ofarrangement may be relatively reduced, and the light emitting devicepackages may be disposed at wide intervals so that a space can beefficiently used. Also, when the light emitting device packages of thehigh output are disposed at narrow intervals, the higher strength oflight than that of the case in which they are disposed at wide intervalscan be obtained.

FIG. 46 and FIG. 47 show distances between the light emitting devicepackages of the light source module used in the tail light for thevehicle and the like according to still another exemplary embodiment.For example, FIG. 46 may show the first light source module 952illustrated in FIG. 44, and FIG. 47 may show the second light sourcemodule 954 illustrated in FIG. 44.

Referring to FIG. 46 and FIG. 47, the light emitting device packages99-1 to 99-n, or 98-1 to 98-m may be disposed on a substrate 10-1 or10-2 to be spaced apart from each other. Here, n may represent naturalnumbers greater than 1, n>1, and m may represent natural numbers greaterthan 1, m>1.

Distances (ph1, ph2, ph3 or pe1, pe2, pe3) between two adjacent lightemitting device packages may be different from each other. However, anappropriate range of the distances may be 8 to 30 mm.

This is because a change may be generated depending on power consumptionof the light emitting device packages 99-1 to 99-n, or 98-1 to 98-m, butwhen the arrangement distance (e.g. ph1, ph2, ph3 or pe1, pe2, pe3) isless than 8 mm, the interference of light of the adjacent light emittingdevice packages (e.g. 99-3 and 99-4) is generated, thereby enabling aperceptible bright portion to be generated. Also, this is because whenthe arrangement distance (e.g. ph1, ph2, ph3 or pe1, pe2, pe3) is morethan 30 mm, a dark portion may be generated due to a region where lightdoes not reach.

As described above, since the light sources 100-1 to 100-17 themselveshave flexibility, they can be easily mounted to the housing 970 having abend. Thus, the tail light for the vehicle 900-2 according to thepresent exemplary embodiment can improve a degree of freedom in design.

Also, since the light source modules 100-1 to 100-17 have a structure inwhich heat dissipation efficiency is improved, in the tail light for thevehicle 900-2 according to the present exemplary embodiment, thegeneration of wavelength shift and the reduction of luminous intensitycan be inhibited.

Since the general tail light for the vehicle illustrated in FIG. 45 is apoint light source, spots 964, 964 may be partially generated from alight emitting surface at the time of light emission. However, since thetail light for the vehicle 900-2 according to the present exemplaryembodiment is a surface light source, uniform brightness and roughnesscan be implemented throughout the whole light emitting surface.

As previously described, in the detailed description of the invention,having described the detailed exemplary embodiments of the invention, itshould be apparent that modifications and variations can be made bypersons skilled without deviating from the spirit or scope of theinvention. Therefore, it is to be understood that the foregoing isillustrative of the present invention and is not to be construed aslimited to the specific embodiments disclosed, and that modifications tothe disclosed embodiments, as well as other embodiments, are intended tobe included within the scope of the appended claims and theirequivalents.

1. A lighting device comprising: a board; a plurality of light sources disposed on the board; a reflection unit disposed on the board; a resin layer disposed on the board so that the plurality of light sources is embedded therein; and a reflector disposed on a side surface of the resin layer, wherein the reflection unit comprises a first reflection sheet disposed on the board, a second reflection sheet disposed on the first reflection sheet, and a plurality of first spacing parts disposed between the first reflection sheet and the second reflection sheet, wherein a cross sectional shape of at least one of the first spacing parts comprises a polygonal shape.
 2. The lighting device according to claim 1, wherein the reflection unit comprises a separation member disposed between the first reflection sheet and the second reflection sheet, wherein each of the plurality of first spacing parts is formed by the separation member.
 3. The lighting device according to claim 2, wherein the separation member comprises a plurality of unit separation members, and a cross sectional shape of at least one of the unit separation members comprises a hexagonal shape.
 4. The lighting device according to claim 3, wherein at least one of the plurality of first spacing parts is disposed in the unit separation members.
 5. The lighting device according to claim 2, wherein at least one of the plurality of first spacing parts is separated by the separation member.
 6. The lighting device according to claim 2, wherein the separation member includes a honeycomb pattern.
 7. The lighting device according to claim 1, wherein a cross sectional shape of at least one of the first spacing parts comprises a hexagonal shape.
 8. The lighting device according to claim 1, wherein the plurality of first spacing parts is spaced away from the resin layer.
 9. The lighting device according to claim 8, comprising an optical pattern layer disposed on the resin layer, wherein the optical pattern layer comprises a first optical sheet disposed on the resin layer, a second optical sheet disposed on the first optical sheet, an optical pattern disposed between the first optical sheet and the second optical sheet, an adhesive pattern layer disposed between the first optical sheet and the second optical sheet, and a second spacing part disposed between the optical pattern and the adhesive pattern layer.
 10. The lighting device according to claim 9, wherein the optical pattern is disposed between the second optical sheet and the second spacing part.
 11. The lighting device according to claim 9, wherein the plurality of light emitting devices comprises a light emitting device, wherein the light emitting device emits light in a first direction, and the first direction is vertical with respect to a thickness direction of the resin layer.
 12. The lighting device according to claim 11, wherein a portion of the optical pattern overlaps with the light emitting devices in the thickness direction.
 13. The lighting device according to claim 11, wherein a portion of the second spacing part overlaps with the light emitting devices in the thickness direction.
 14. The lighting device according to claim 9, wherein the optical pattern comprises a plurality of layers, each comprising a different pattern.
 15. The lighting device according to claim 2, wherein the first reflection sheet and the second reflection sheet comprise a plurality of holes through which the plurality of light sources penetrate.
 16. The lighting device according to claim 9, wherein the first reflection sheet and the second reflection sheet comprise a plurality of holes through which the plurality of light sources penetrate.
 17. A lighting device comprising: a board; a plurality of light sources disposed on the board; a reflection unit disposed on the board; a resin layer disposed on the board so that the plurality of light sources is embedded therein; and a reflector disposed on a side surface of the resin layer, wherein the reflection unit comprises a first reflection sheet disposed on the board, a second reflection sheet disposed on the first reflection sheet, and a separation member disposed between the first reflection sheet and the second reflection sheet, wherein the separation member comprises a plurality of unit separation members, and a cross sectional shape of at least one of the unit separation members comprises a polygonal shape.
 18. The lighting device according to claim 1, wherein a distance to an upper surface of the reflector from a lower surface of the board is greater than a distance to an upper surface of the resin layer from the lower surface of the board.
 19. The lighting device according to claim 17, wherein a cross sectional shape of at least one of the first spacing parts comprises a hexagonal shape.
 20. The lighting device according to claim 17, wherein the separation member includes a honeycomb pattern. 